Mettler Toledo TDLS GPro 500 Tunable Diode Laser Spectrometer for Oxygen Instruction Manual
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Operating Instructions TDLS GPro 500 Tunable Diode Laser Spectrometer TABLE OF CONTENT 1 Introduction..............................................................................................................11 1.1 Safety information.............................................................................................. 11 1.2 General............................................................................................................. 11 1.3 Safety Instructions..............................................................................................12 1.3.1 For M400 Type 3 4-wire series...................................................................12 1.3.2 Safety Instructions for installation, operation and maintenance in hazardous locations (ATEX) GPro 500 series...........................................13 1.3.3 Connection to supply units.........................................................................14 1.3.4 General safety precautions for installation, operation and maintenance in hazardous locations GPro 500 series......................................................14 1.4 Introduction and Measurement principle................................................................15 1.4.1 Dust load.................................................................................................16 1.4.2 Temperature.............................................................................................16 1.4.3 Pressure..................................................................................................16 1.4.4 Cross interference.....................................................................................17 1.5 Instrument description........................................................................................18 1.5.1 System Overview......................................................................................18 1.5.2 Sensor head.............................................................................................22 1.5.3 Insertion probes........................................................................................23 1.5.4 M400 type 3 transmitter............................................................................23 1.6 Software...........................................................................................................23 1.7 Laser classification.............................................................................................23 1.8 Product data......................................................................................................24 2 Preparations.............................................................................................................31 2.1 Tools and other equipment..................................................................................31 2.2 Flow conditions at measuring point......................................................................31 2.3 Measuring head placement (probe installations)....................................................31 2.4 Flanges and stack hole requirements (Probe installations)......................................32 2.5 Cables and electrical connections........................................................................32 3 Installation and Start-up........................................................................................... 34 3.1 Installation and adjustments............................................................................... 34 3.1.1 Mechanical installation............................................................................. 34 3.1.2 Process side purging (not applicable to non-purged probe [NP] and ­extractive cell [E])................. 34 3.1.3 Adjusting the purging flow (for standard purged [SP] and in-line wafer [W] cells)...................................................................... 36 3.1.4 Signal Optimization...................................................................................37 3.1.5 Solar radiation and process radiated heat................................................... 39 3.2 Alignment......................................................................................................... 40 3.2.1 Signal Optimization.................................................................................. 40 3.3 Installation & Commissioning..............................................................................41 4 Dimensions and Drawings........................................................................................ 43 3 Laser Spectrometer GPro 500 5 Electrical Connections.............................................................................................. 67 5.1 Electrical Safety and Grounding.......................................................................... 68 5.2 Sensor head connections....................................................................................71 5.3 M400 connections.............................................................................................78 6 Service................................................................................................................... 80 6.1 Connecting a PC............................................................................................... 80 6.2 Setting up your PC to connect to the GPro 500 using the MT-TDL Software...............81 6.3 The MT-TDL software......................................................................................... 84 6.3.1 The ppm trend......................................................................................... 85 6.3.2 The transmission trend............................................................................. 86 6.3.3 Data logging............................................................................................87 6.3.4 External sensors...................................................................................... 88 6.3.5 Diagnostic.............................................................................................. 89 6.3.6 Calibration data....................................................................................... 90 6.3.7 Analog Outputs (optional)..........................................................................91 6.4 The Viewer....................................................................................................... 93 7 Operation, Maintenance and Calibration................................................................... 94 7.1 M400.............................................................................................................. 94 7.1.1 Instrument Start-up.................................................................................. 95 7.1.2 Instrument Shut-down.............................................................................. 95 7.2 Verification and Maintenance.............................................................................. 96 7.3 Maintenance......................................................................................................97 7.3.1 Routine maintenance.................................................................................97 7.3.2 Remove the probe or wafer cell from the process..........................................97 7.3.3 Removing & cleaning the corner cube........................................................ 98 7.3.4 Cleaning the probe process window........................................................... 98 7.4 Calibration.......................................................................................................100 7.4.1 Process Calibration.................................................................................100 7.4.2 Calibration using calibration cells (O2 only)...............................................100 7.5 Residual Hazards............................................................................................. 101 7.5.1 Leaky connections.................................................................................. 101 7.5.2 Electricity failure...................................................................................... 101 7.5.3 Heat protection....................................................................................... 101 7.5.4 External influences.................................................................................. 101 8 Explosion Protection...............................................................................................102 8.1 ATEX...............................................................................................................102 8.2 FM Approval (US Version) Oxygen Measurement.................................................. 114 9 Troubleshooting...................................................................................................... 119 9.1 Error messages in the control unit...................................................................... 119 10 Decommissioning, Storage and Disposal.................................................................121 10.1 Decommissioning............................................................................................ 121 10.2 Storage........................................................................................................... 121 10.3 Disposal......................................................................................................... 121 4 APPENDIX Appendix 1 Compliance and Standards Information.......................................................122 Appendix 2 Spare Parts and Accessories......................................................................123 2.1 Configuration Options...........................................................................123 2.2 Spare parts.........................................................................................126 2.3 Accessories.........................................................................................126 Appendix 3 Disposal in Accordance with the Waste Electrical and Electronic Equipment (WEEE) Directive.......................................................................................127 Appendix 4 Equipment Protection.................................................................................128 4.1 Traditional Relationship of Equipment Protection Levels (EPLs) to Zones..... 128 4.2 Relationship of Equipment Protection Levels to ATEX Categories................. 128 Appendix 5 ESD Guidelines..........................................................................................129 5 FIGURES Laser Spectrometer GPro 500 Figure 1 General schematic of standard purge probe (SP) shown........................................19 Figure 2 GPro 500, shown with standard probe (SP)........................................................ 20 Figure 3 The junction box (GHG 731 from Malux) (EX-e).....................................................21 Figure 4 M400 transmitter Type 3....................................................................................21 Figure 5 Minimum free space at the process flange............................................................31 Figure 6 Optimizing the purge flow.................................................................................. 36 Figure 7 Purging configuration for standard purged probe (SP)...........................................37 Figure 8 Connecting purge pipe to process side purge fitting.............................................. 38 Figure 9 Purge gas rotameter connections for standard purge (SP) probe............................ 38 Figure 10 Dimensions of the standard probe (SP)............................................................... 43 Figure 11 Dimensions of the non-purged probe (NP) with filter............................................. 45 Figure 12 Dimensions of the non-purged probe (B) with Block-Back......................................47 Figure 13 B probe with blow-back using M400 (DC solenoid valve)...................................... 50 Figure 14 B probe with blow-back using M400 (AC solenoid valve).......................................51 Figure 15 Dimensions of the wafer (W)..............................................................................52 Figure 16 Dimensions of the extractive cell (E)................................................................... 54 Figure 17 Dimensions of the extractive dual window........................................................... 56 Figure 18 Dimensions of the extractive cell PFA.................................................................. 58 Figure 19 Dimensions of the extractive white cell................................................................ 60 Figure 20 One flange configuration................................................................................... 63 Figure 21 Two flange configuration................................................................................... 63 Figure 22 Dimensions of the DN50 / PN25 flange for standard purge probe (SP) and non-purged probe (NP).............................................................................. 64 Figure 24 Dimensions of the DN50 / PN16 flange for standard purge probe (SP) and non-purge probe (NP)................................................................................ 64 Figure 26 Dimensions of the DN80 / PN16 flange for standard purge probe (SP) and non-purge probe (NP)................................................................................ 64 Figure 23 Dimensions of the ANSI 2" / 300lb flange for standard purge probe (SP) and non-purged probe (NP).............................................................................. 64 Figure 25 Dimensions of the ANSI 2" / 150lb flange for standard purge probe (SP) and non-purge probe (NP)................................................................................ 64 Figure 27 Dimensions of the ANSI 3” / 150lb flange for standard purge probe (SP) and non-purge probe (NP)................................................................................ 64 6 Figure 28 Dimensions of the RF DN100 / PN25 flange for standard purge probe (SP) and non-purge probe (NP)................................................................................ 65 Figure 29 Dimensions of the RF ANSI 4" / 300 lb flange for standard purge probe (SP) and non-purge probe (NP)................................................................................ 65 Figure 30 Recommended welded flange dimensions (for standard (SP) and non-purged (NP) and blow-back (B) probe installations)................................ 66 Figure 31 Dimensions of the thermal barrier....................................................................... 66 Figure 32 External earth point. Standard probe (SP) process adaptor shown..........................70 Figure 33 Protective Grounding..........................................................................................70 Figure 34 Connections in the junction box...........................................................................71 Figure 35 Wiring diagram with active analog inputs. ...........................................................72 Figure 36 Wiring diagram with loop-powered analog inputs..................................................73 Figure 37 The junction box GHG 731.11 (EX-e) ...................................................................74 Figure 38 Connections in the junction box...........................................................................75 Figure 39 Connections on motherboard in the sensor head...................................................76 Figure 40 Connections on IO board in the sensor head.........................................................76 Figure 41 Cable connections in M400................................................................................78 Figure 42 Connecting a PC. Standard probe (SP) process adaptor shown............................. 80 Figure 43 Network connections..........................................................................................81 Figure 44 Local area connections......................................................................................81 Figure 45 Local area connection properties.........................................................................82 Figure 46 Internet protocol (TCP/IP) properties.................................................................... 83 Figure 47 The ppm trend.................................................................................................. 85 Figure 48 The transmission trend...................................................................................... 86 Figure 49 Data logging.....................................................................................................87 Figure 50 External sensors............................................................................................... 88 Figure 51 Diagnostic....................................................................................................... 89 Figure 52 Calibration....................................................................................................... 90 Figure 53 Analog outputs (optional)...................................................................................91 Figure 54 Selecting a parameter....................................................................................... 92 Figure 55 Selecting alarms............................................................................................... 92 Figure 56 Selecting hold mode......................................................................................... 93 7 Figure 57 The viewer....................................................................................................... 93 Figure 58 M400 front...................................................................................................... 94 Figure 59 Calibration cell..................................................................................................97 Figure 60 Cleaning/Replacing the corner cube on standard probe (SP) and non-purged probe (NP)............................................................................... 98 Figure 61 Connecting purge pipe to process side purge fitting.............................................. 99 Figure 62 Cleaning the probe process window.................................................................... 99 Figure 63 Calibration cell................................................................................................ 101 Figure 64 Ex setup.........................................................................................................102 Figure 65 The GPro 500 Interface between Zone 0 and Zone 1............................................103 Figure 66 Label..............................................................................................................104 Figure 67 Note label.......................................................................................................104 Figure 68 Grounding label...............................................................................................104 Figure 69 ATEX Cerfificate (page 1/2)...............................................................................105 Figure 70 ATEX Cerfificate (page 2/2)...............................................................................106 Figure 71 EC Declaration of conformity (page 1/2)............................................................107 Figure 72 EC Declaration of conformity (page 2/2)............................................................108 Figure 73 SIL Declaration of conformity............................................................................109 Figure 74 IECEx Cerfificate (page 1/4).............................................................................. 110 Figure 75 IECEx Cerfificate (page 2/4).............................................................................. 111 Figure 76 IECEx Cerfificate (page 3/4).............................................................................. 112 Figure 77 IECEx Cerfificate (page 4/4).............................................................................. 113 Figure 78 Label for US version......................................................................................... 114 Figure 79 Note label....................................................................................................... 115 Figure 80 Grounding labels............................................................................................. 115 Figure 81 FM-Certificate. FM Approvals (page 1/3)............................................................. 116 Figure 82 FM-Certificate. FM Approvals (page 2/3)............................................................. 117 Figure 83 FM-Certificate. FM Approvals (page 3/3)............................................................. 118 8 TABLES Table 1 Product data sensor head...................................................................................24 Table 2 Product data probe........................................................................................... 29 Table 3 Product data M400........................................................................................... 30 Table 4 Installation examples........................................................................................ 62 Table 5 GPro 500 cables...............................................................................................74 Table 6 GPro 500 cables...............................................................................................77 Table 7 Mains power supply terminals.............................................................................78 Table 8 RS 485 connection of GPro 500 to M400 terminal TB4.........................................79 Table 9 M400 terminal TB1 relay connections..................................................................79 Table 10 M400 4 – 20mA Output connections....................................................................79 Table 11 Error messages............................................................................................... 119 Table 12 GPro 500 Product key...................................................................................... 124 Table 13 Spare parts.....................................................................................................126 Table 14 Accessories....................................................................................................126 9 10 1 Introduction 1.1 Safety information Read this manual and ensure that you fully understand its content before you attempt to install, use or maintain the GPro®* 500. Important safety information is highlighted in this manual as WARNINGs and CAUTIONs, which are used as follows: WARNING Warnings highlight specific hazards which, if not taken into account, may result in personal injury or death. CAUTION Cautions highlight hazards which, if not taken into account, can result in damage to the TDL or to other equipment or property. This manual also incorporates “be aware of” information, which is used as follows: This highlights information which it is useful for you to be aware of (for example, specific operating conditions, and so on). 1.2 General This manual contains information of installation, operation and maintenance of the GPro 500 TDL. A description of the GPro 500 TDL and its basic features is also included. The GPro 500 TDL is available for use in explosive atmospheres as defined in EN 60079-14 (ATEX) or IEC 60079-10 (ATEX). For more information on Equipment Protection Levels refer to chapter 8 (Explosion Protection) on page no 102 and Relationship of Equipment Protection Levels to ATEX Categories on page no 128. Please read the entire manual carefully before using the GPro 500 TDL. It is a sophisticated instrument utilizing state-of-the-art electronic and laser technology. Installation and maintenance of the instrument require care and preparation and should only be attempted by competent personnel. Failure to do so may damage the instrument and void the warranty. CAUTION METTLER TOLEDO strongly recommends having the final installation and commissioning executed under the full supervision of a METTLER TOLEDO representative. Do not power up the system before the wiring has been fully checked by trained personal. It is strongly recommended to have the wiring approved by a METTLER TOLEDO Service representative. Wrong wiring can lead to damage of the sensor head and/or the M400 transmitter. * GPro is a registered trademark of the Mettler Toledo Group in Switzerland, India, USA, China, European Union, Japan, South Korea and Russia. 11 CAUTION Laser Spectrometer GPro 500 Do not install the probe into the process without the purging being switched on. Without purging, optical components in the probe may be contaminated and therefore affect the GPro 500’s ability to measure. METTLER TOLEDO strongly recommends having the final installation and commissioning executed under the full supervision of a METTLER TOLEDO representative. 1.3 Safety Instructions 1.3.1 For M400 Type 3 4-wire series Before connecting the device to a supply unit make sure that its output voltage cannot exceed 30 V DC, or be less than 20 V DC. Do not use alternating current or main power supply. WARNING Installation of cable connections and servicing of this product require access to shock hazard voltage levels. WARNING Power supply and relay or open collector (OC) contacts wired to separate power source must be disconnected before servicing. WARNING Power supply must employ a switch or circuit breaker as the disconnecting device for the equipment. WARNING Electrical installation must be in accordance with the National Electrical Code and/or any oter applicable national or local codes. RELAY RESP. OC CONTROL ACTION: the M400 transmitter relays will always deenergize on loss of power, equivalent to normal state, regardless of relay state setting for powered operation. Configure any control system using these relays with fail-safe logic accordingly. PROCESS UPSETS: Because process and safety conditions may depend on consistent operation of this transmitter, provide appropriate means to maintain operation during sensor cleaning, replacement of sensor or instrument calibration. 12 1.3.2 Safety Instructions for installation, operation and maintenance in hazardous locations (ATEX) GPro 500 series WARNING Devices of these series are approved for operation in hazardous locations. WARNING During installation, commissioning and usage of the device, the stipulations for electrical installations (IEC EN 60079-14/IEC EN 60079-10) in hazardous areas must be observed. WARNING When installing the device outside the range of applicability of the 94/EC directive, the appropriate standards and regulations in the country of use must be observed. WARNING Manipulations of the device other than described in the instruction manual are not permitted. The GPro 500 comes with a pre-installed cable and cable gland. Do not attempt to replace the cable as it will void the warranty and violate the ATEX classification! WARNING Opening the sensor head voids warranty and violates the ATEX hazardous area classifications! WARNING Installation may only be carried out by trained personal in accordance with the instruction manual and as per applicable standards and regulations. –– Cleaning: In hazardous locations the device may only be cleaned with damp cloth to prevent electrostatic discharge. 13 Laser Spectrometer GPro 500 1.3.3 Connection to supply units US Version: The US version must be installed using a suitable cabling conduit system in accordance with local codes and regulations. To aid installation, the unit is supplied without an attached cable. The terminals are suitable for single wires/flexible leads 0.2 mm2 to 1.5 mm2 (AWG 24–16). WARNING The electrical installation must be performed in accordance with National Electrical Codes of practise and/or any other applicable national or local codes. WARNING Wait 2 minutes before opening the enclosure after de-energizing the system. WARNING When fitting the enclosure cover onto the sensor head, the 8 x M5 fixing screws must be tightened to 8 Nm torque. WARNING For gas group A, sealing of the conduit is required at the enclosure entry. For gas groups B, C and D, no conduit sealing is required. 1.3.4 General safety precautions for installation, operation and maintenance in hazardous locations GPro 500 series WARNING Devices of these series are approved for operation in hazardous locations. WARNING During installation, commissioning and usage of the device, the stipulations for electrical installations (IEC EN 60079-14/IEC EN 60079-10) in hazardous areas must be observed. WARNING When installing the device outside the range of applicability of the 94/EC directive, the appropriate standards and regulations in the country of use must be observed. 14 WARNING Operation of this device other than as described in this manual or the addition of non-approved modifications to the product is prohibited. WARNING Installation may only be carried out by trained personal in accordance with the instruction manual and as per applicable standards and regulations. –– Cleaning: In hazardous locations the device may only be cleaned with damp cloth to prevent elctrostatic discharge. Connection to supply units –– Devices of the above mentioned series must only be connected to explosion proof power supply units (for input ratings refer to instruction manual EC-Type-Examination Certificate). –– The terminals are suitable for single wires/flexible leads 0.2 mm2 to 1.5 mm2 (AWG 24–16). WARNING The external power supply used to power the TDL sensor head should not exceed 24 V DC, with a minimum power rating of 5 watts. Correct disposal of the unit –– When the unit is finally removed from service, observe all local environmental regulations fro proper disposal. 1.4 Introduction and Measurement principle The GPro 500 TDL is a precision optical instrument designed for continuous in-situ or extractive gas measurement, based on tunable diode laser absorption spectroscopy (TDLS). The GPro 500 TDL provides a high performance & flexible gas measurement solution. It is supplied with a process adaptor specific optimized for the application. For in-situ applications these include standard purged probes and wafer cells, non-purged probes (with or without integrated particulate filter) & filtered wafer (W) cells. For extractive applications, a variety of extractive cells options are available.. For in-situ applications utilizing the standard purged probe or wafer cell; to ensure reliable measurement performance, it is important that there is flowing process gas at the measurement location. See chapter 2.2 (Flow conditions at measuring point) on page 28 and chapter 3.1.2 (Process side purging) page 31 for further details. (This does not apply to non-purged probes or extractive cells). GPro 500 TDL is suitable for use in industrial environments or environments where it may be connected to a mains electrical network supplying domestic premises. The measuring principle used is infrared single-line absorption spectroscopy, which is based on the fact that each gas has distinct absorption lines at specific wavelengths. The absorption lines are carefully selected to avoid cross interference from other (background) gases. Using direct absorption spectroscopy, a spectrum in a specific wavelength range is taken and compared with spectral reference data stored in the on-board database for any given temperature and pressure. The concentration is then calculated. Any inconsistency between reference data and measurement data will trigger an alarm. The detected light intensity varies as a function of the laser wavelength due to absorption of the targeted gas molecules in 15 Laser Spectrometer GPro 500 the optical path between the laser and the detector. The laser line width is a small fraction of the absorption line width so the reproduced spectra is very accurate. The instrument stores the spectral data in its memory and once a scan is obtained a curve fitting to this data is performed yielding a measurement value. Account is also taken to the process gas temperature and pressure and these parameters are measured separately or they can be manually fixed. The GPro 500 TDL is a gas analyzer and as such measures the FREE molecules of the specific gas of interest. It will not detect such molecules when they are bound together into larger molecular structures or when attached to particles or dissolved into droplets. This should be carefully considered when comparing measurement results with other measurement techniques. 1.4.1 Dust load As long as the laser beam is able to generate a signal for the detector, the dust load of the process gases does not influence the analytical result. By amplifying the signal automatically, measurements can be carried out without any negative impact. The influence from high dust load is complex and is dependent on the optical path length (probe length), particle size and particle size distribution. At longer path lengths the optical attenuation increases rapidly. Smaller particles also have a significant impact on the optical attenuation: the smaller the particles are, the more difficult the measurement will be. The general impact on the measurement result in high dust load is an increased noise level. For high dust load applications, please consult your local METTLER TOLEDO representative, see "Sales and Service" on page no 130. 1.4.2 Temperature The temperature influence on an absorption line must be compensated for. An external temperature sensor can be connected to the GPro 500. The signal is then used to correct the measurement results. Without temperature compensation the measurement error caused by process gas temperature changes affects the measurement substantially. Therefore, in most cases an external temperature signal is ­recommended. The manual mode with fixed temperature and pressure values is only recommended with processes where these values are constant and well known. Temperature sensor requirements: 4 – 20 mA output, either active or loop powered, with range suitable for process temperature range. The sensor must also meet the local hazardous zone requirements. Temperature sensor accuracy requirements are: Pt100 or equivalent, +/– 0.01 °C or better, with configurable 4 – 20 mA outputs. Rule of Thumb: For oxygen measurements, typically a delta of 1 degree C equals 500 ppm O2 change in reading in normal air, without compensation. 1.4.3 Pressure The process gas pressure affects the line shape of a molecular absorption line and influences the measurement results. An external pressure sensor can be connected to the GPro 500. When the correct process gas pressure is supplied, the GPro 500 uses a special algorithm to adapt the line shape and effectively compensate for the pressure influence as well as the density effect. Without compensation the measurement error caused by process gas pressure changes is substantial. Therefore, in most cases an external pressure signal is recommended. The manual mode with fixed temperature and pressure values is only recommended with processes where these values are constant and well known. Pressure sensor requirements: 4 – 20 mA output, either active or loop powered, with range suitable for the process pressure range. The sensor must also meet the local hazardous zone requirements. Pressure sensor accuracy requirements are: +/– 1 mbar or better, with configurable 4 – 20 mA outputs. 16 Rule of Thumb: For oxygen measurements, typically a delta of 50mbar equals 1% O2 change in reading in normal air, without compensation. Note: It is recommended that a pressure sensor referenced to absolute pressure is used to negate errors caused by atmospheric pressure variation. The pressure sensor must always be mapped to the TDL input as an absolute sensor, so if a gauge sensor is used, the nominal atmospheric pressure value will need to be added to the values entered for pressure min (4 mA) and pressure max (20 mA). WARNING Ensure P & T sensors are connected before applying loop power. 1.4.4 Cross interference Since the GPro 500 derives its signal from fully-resolved molecular absorption lines, cross interference from other gases is minimized. The GPro 500 is therefore able to measure the desired gas component very selectively. CAUTION Always take great care when choosing the measurement location. Positions where there are fewer particles, the temperature is lower or there is a more suitable process pressure, are recommended. The more optimized the measurement location is, the better the overall performance of the system will be. Please consult your Mettler Toledo representative ("Sales and Service" on page no 130). 17 Laser Spectrometer GPro 500 1.5 Instrument description 18 The GPro 500 TDL normally consists of 4 separate units: the TDL head, process adaptor, junction box and the M400 transmitter (user interface). Additionally purging gas, (suitable for the application) and 4–20mA pressure and temperature sensor inputs are required in most cases. The general installation diagrams for purged and non-purged probes, wafer cells and extractive measurements are shown on Page 18 1.5.1 System Overview A connecting device is required between the TDL and the M400 transmitter. For ATEX applications, an existing junction box can be used, or one can be ordered as an accessory (see Appendix chapter 2.3 (Accessories) on page no 126). The 4–20 mA signals for temperature and pressure compensation are connected to the sensor’s head via this junction box. The junction box also provides the connection point for the GPro 500 Ethernet interface connection.. For more information in installation in hazardous areas, please refer to chapter 8 (Explosion Protection) on page no 102. In standard configurations the GPro 500 is connected to the M400 transmitter. This offers a flexible user interface that not only displays concentration and other measurement parameters in real-time, but can be used to configure specific analyzer parameters during commissioning and subsequent verification and calibration of the system. This avoids the requirement for using a PC at the measurement location to configure the analyzer. In addition, the M400 offers additional I/O capabilities, i.e. 4x 4…20 mA active analog outputs and 6 relays. Alternatively, if GPro 500 is supplied as an additional output version. This version provides 2 x 4…20 mA passive analog outputs directly from the sensor head and offers a full Ex-d solution. In this case a M400 transmitter is not supplied and a M400 should not be connected to the sensor head. To configure the optional direct analog outputs, it is necessary to use the MT-TDL software Suite to configure the GPro 500 during commissioning (using the Ethernet connection to the GPro 500, see item 6 on see Figure 1 (General schematic of standard purge probe (SP) shown.) on page no 19). For more information on the MT-TDL Software, please refer to chapter see 6 (Service) on page no 80. Figure 1 General schematic of standard purge probe (SP) shown. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 GPro 500 sensor head with insertion probe (here the 390 mm probe) Purging with N2, one inlet for the process side and one inlet and one outlet for the sensor side. Process flange (DN50/PN25 or ANSI 2”/300lb) Junction box (connecting device) 2 x 4...20 mA (pressure and temperature) Ethernet connection RS 485 M 400 T3 transmitter 4...20 mA output for Concentration 4...20 mA output for Pressure 4...20 mA output for Temperature 4...20 mA output for % Transmission Relay outputs for alarm purposes. The relays are configurable and there are 6 relays available in total. Power for the M400. Grounding for the TDL head. External power supply. 24 V, 5 W for the sensor power head. 2 x 4…20 mA direct analog outputs (optional). WARNING When connecting the external power supply directly to the sensor head using the junction box, do not exceed the 24 V, 5 W limit required. WARNING When selecting the TDL sensor head external power supply, care should be taken to ensure its output does to exceed 24 V DC, and has a power output rating of 5 watts minimum. 19 Laser Spectrometer GPro 500 20 Figure 2 GPro 500, shown with standard probe (SP) The GPro 500 consists of the TDL head which contains the laser module with a temperature stabilized diode laser, collimating optics, the main electronics and data storage. It is housed in a coated aluminium box. The process adaptor attaches to the TDL head. Dependent on the application, this may be a purge, purge free or filter probe, in-line wafer cell or extractive cell. The TDL head has environmental protection to IP65, NEMA 4X. The GPro 500 is installed by assembling the supplied purging and then mounted onto the process flange DN50 or ANSI 2" – see (Dimensions of the DN50/PN25 flange for standard purge probe (SP) and non-purged probe (NP) on page no 19). The optical alignment is robust and reliable and does not require manual alignment. For the standard purge probe (SP) and wafer cell, purging prevents dust and other contamination from settling on the optical surfaces. For clean and static processes (for example headspace monitoring), a non-purge probe (NP) may be supplied. In this case process side purge is not required. Figure 3 The junction box (GHG 731 from Malux) (EX-e). The junction box is the connection point for the measurement probe, the pressure sensor, the temperature sensor, Ethernet and M400. Figure 4 M400 transmitter Type 3 21 For more information refer to chapter 7.1 (M400) on page no 94 and the M400 manual. Laser Spectrometer GPro 500 Approval for the M400 is Class 1 Div 2/Zone 2 ATEX. For installation in Zone 1 areas, see "Accessories" on page no 126 – Purging box for M400. 1.5.2 Sensor head The combined tunable diode laser and receiver assembly is known as the TDL head. This contains the laser, optics and all the electronics for laser control, signal processing, line locking, detector electronics, data storage/retrieval, current outputs (optional), etc. The sensor head has an Ethernet interface, accessible via the junction box, for high level maintenance by the use of METTLER TOLEDO Process Analytics specific software (MT-TDL). All components of the sensor head are non-wetted and are therefore under normal conditions are never in contact with the process stream. The power required for the sensor head is 24 V, 5 W minimum. The connection between the sensor head and the process adaptor (probe, wafer or extractive cell) is a precision machined interface. Care should be taken to ensure that the metal surfaces are carefully aligned when installing the sensor head to prevent damage. ATEX Version: In the ATEX Version, the sensor head is supplied with a pre-configured cable already installed. Do not open the sensor head for removing, altering, or replacing the cable. The standard cable length is 5 m, but optional lengths of 15 m, 25 m and 40 m are also available. For the ATEX version, note that this cable must not be removed or changed by the user as opening the TDL blue cover will void the ATEX hazardous area certification. WARNING Opening the sensor head voids warranty and violates the ATEX hazardous area classifications. US Version: The US version must be installed using a suitable cabling conduit system in accordance with local codes and regulations. To aid installation, the unit is supplied without an attached cable. METTLER TOLEDO recommends the use of suitable cables listed as accessories in Appendix 2 (Spare Parts and Accessories) on page no 123 The terminals are suitable for single wires/flexible leads 0.2 mm2 to 1.5 mm2 (AWG 24–16). WARNING The electrical installation must be performed in accordance with National Electrical Codes of practise and/or any other applicable national or local codes. WARNING Wait 2 minutes before opening the enclosure after de-energizing the system. 22 WARNING When fitting the enclosure cover onto the sensor head, the 8 x M5 fixing screws must be tightened to 8 Nm torque. WARNING For gas group A, sealing of the conduit is required at the enclosure entry. For gas groups B, C and D, no conduit sealing is required. 1.5.3 Insertion probes Probes exists in several versions, including purged (SP), non-purged (NP) depending on the application. Both material of construction (windows, metals, O-rings, etc.) and insertion length can be customized to particular needs. 1.5.4 M400 type 3 transmitter This is the GPro Series user interface. With the M400 the user can set the necessary parameters for operation, and control the alarm and I/O setup. The M400 will of course also display the measured gas concentration, the process temperature and pressure as well as the transmission (signal quality/ strength). It features class 1 Div 2 FM approval (ATEX zone 2) and four 4–20 mA active analog outputs. M400 also features ISM – Intelligent Diagnostics – which provides the following features:: –– Time to Maintenance Indicator (TTM). Real time, dynamic prediction of when the next maintenance cycle is required for best operation. Action: Clean the optics (window, corner cube) –– Dynamic Lifetime Indicator (DLI). Based on the DLI information, the transmitter tells you when it’s time to replace the TDL. Action: Replace TDL (Expected lifetime >10 years) 1.6 Software Software for the GPro 500 TDL consists of 2 programs: • A program not visible to the user and integrated in the CPU electronics, running the micro controller on the CPU card. The program performs all necessary calculations and self-monitoring tasks. • MT-TDL Suite: a Windows based program running on a standard PC connected through the Ethernet connection. This program enables communication with the instrument during installation, service, calibration and normal operation. See chapter 6 (Service) on page no 80 for more details. It is only necessary to connect a PC for advanced maintenance, normal installation and service/calibration can be done via M400. Both communication ports (Ethernet and RS 485) to the M400 can be used at the same time. However, during access with a PC no changes are allowed on the M400. 1.7 Laser classification The diode lasers used in the GPro 500 TDL operate in the near infrared (NIR). It has an output power which, according to IEC 60825-1 latest edition, classifies the GPro 500 TDL as a Laser Class 1M product. 23 Laser Spectrometer GPro 500 24 WARNING Class 1M laser product Laser radiation – do not view directly with optical instruments Note that the laser emits invisible light! 1.8 Product data Table 1 Product data sensor head Size and weight Dimensions 524,5 x Ø175,5 mm Weight 8 kg Material of construction Steel 316L Optical elements AR coated Quartz, AR coated Borosilicate Seals Kalrez® 6674, Graphite compounds Blue cover-Aluminum Paint finish – Chemically resistant epoxy resin coating 25 < 0…01% vol O2 (100 ppm-v) Negligible (< 2% of measurement range Negligible (< 2% of measurement range Negligible (< 2% of measurement range between maintenance intervals) between maintenance intervals) between maintenance intervals) 1 second O2 in N2 21% > 0% in < 2 sec < 0…01% vol O2 (100 ppm-v) 1 second O2 in N2 21% > 0% in < 2 sec Typically <1 hour ± 0.25% of reading or 0.05% O2 (whichever is greater) 0.3 bar – 8 bar (abs)/ 4.35 psi – 116.03 psi (abs) Resolution Drift Sampling rate Response Time (T90) Warm up time Repeatability Process pressure range * from Firmware 6.23 Process temperature range Better than 1% Better than 1% Linearity 0.8 bar – 2 bar (abs)/ 11.63 psi – 29.00 psi (abs) 0 – + 250 °C (+ 32 – + 482 °F) Optional (for probe installation) 0 – + 600 °C (0 – +1112 °F) with additional thermal barrier, 0 – +150 °C (+ 32 – + 302 °F) (White cell) 0.8 bar – 5 bar (abs)/ 11.63 psi – 72.52 psi (abs)* Typically <1 hour ± 0.25% of reading or 5 ppm-v CO (whichever is greater) Typically <1 hour ± 0.25% of reading or 0.05% O2 (whichever is greater) CO in N2 300 ppm-v to 0% in < 4 sec 1 second 1 ppm-v Better than 1% 2% of reading or 1 ppm (­whichever is greater) 2% of reading or 100 ppm O2 (­whichever is greater) 2% of reading or 100 ppm O2 (­whichever is greater) Accuracy 0 – 2% 1 ppm-v 1 – 100% 0 – 150 °C (32 – +302 °F) 100 ppm-v 2 °C (35.6 °F) 0 – 100% CO (ppm) Probes: 200, 400 mm, 800 mm (3.94", 7.87", 15.75") Wafer Cell: 104 mm, 110 mm, 154 mm, 164 mm, 214 mm (4.09", 4.33", 6.06", 6.46", 8.43") Extractive cells: 200, 400, 800, 1 m, 10 m (7.87", 15.75", 31.49", 39.37", 393.70") O2 and temperature Lower Dectection Limit (in 1 meter path 100 ppm-v length at ambient standard conditions, dry gas, no dust load, in N2 back­ ground) Measurement range and standard conditions (ambient temperature and pressure, 1 m path length) Optical path length O2 Measurement (All measurement specifications with reference to standard conditions T & P with no dust or particulates) 26 Negligible (< 2% of measurement range Negligible (< 2% of measurement range Negligible (< 2% of measurement range between maintenance intervals) between maintenance intervals) between maintenance intervals) 1 second CO in N2 1% to 0% in < 4 sec Typically <1 hour Drift Sampling rate Response Time (T90) Warm up time Repeatability Process pressure range Process temperature range 1500 ppm-v Resolution ± 0.25% of reading or 5000 ppm-v CO2 (whichever is greater) ± 0.25% of reading or 50 ppm-v H2O (whichever is greater) 0.8 bar – 2 bar (abs)/ 11.63 psi – 29.00 psi (abs) ± 0.25% of reading or 0.75%-v CO (whichever is greater) 0.8 bar – 1.5 bar (abs)/ 11.63 psi – 21.75 psi (abs) 0 – + 250 °C (+ 32 – + 482 °F) Optional (for probe installation) 0 – + 600 °C (0 – +1112 °F) with additional thermal barrier, 0 – +150 °C (+ 32 – + 302 °F) (White cell) 0.8 bar – 2 bar (abs)/ 11.63 psi – 29.00 psi (abs) Typically <1 hour CO2 in N2 1% to O% in < 4 sec H2O in N2 1% to O% in < 4 sec Typically <1 hour 1 second 1000 ppm-v Better than 1% 1 second 5 ppm-v Better than 1% Better than 1% Linearity 2% of reading or 1000 ppm, (whichever is greater) 2% of reading or 10 ppm, (whichever is greater) 2% of reading or 1500 ppm, (whichever is greater) 1000 ppm-v 0 – 100% Accuracy 0 – 20% 5 ppm-v 0 – 100% CO2 (%) Probes: 200, 400 mm, 800 mm (3.94", 7.87", 15.75") Wafer Cell: 104 mm, 110 mm, 154 mm, 164 mm, 214 mm (4.09", 4.33", 6.06", 6.46", 8.43") Extractive cells: 200, 400, 800, 1 m, 10 m (7.87", 15.75", 31.49", 39.37", 393.70") H2O Lower Dectection Limit (in 1 meter path 1500 ppm-v length at ambient standard conditions, dry gas, no dust load, in N2 back­ ground) Measurement range and standard conditions (ambient temperature and pressure, 1 m path length) Optical path length CO (%) Measurement (All measurement specifications with reference to standard conditions T & P with no dust or particulates) Laser Spectrometer GPro 500 27 H2S (%) HCl in N2 1% to O% in < 4 sec 1 second CO2 in N2 1% to O% in < 4 sec Typically <1 hour ± 0.25% of reading or 5000 ppm-v CO2 or CO (whichever is greater) 0.8 bar – 2 bar (abs)/ 11.63 psi – 29.00 psi (abs) Drift Sampling rate Response Time (T90) Warm up time Repeatability Process pressure range Process temperature range Negligible (< 2% of measurement ­range Negligible (< 2% of measurement ­range Negligible (< 2% of measurement ­range between maintenance intervals) between maintenance intervals) between maintenance intervals) 1 second 1000 ppm-v Resolution 0 – + 250 °C (+ 32 – + 482 °F) Optional (for probe installation) 0 – + 600 °C (0 – +1112 °F) with additional thermal barrier, 0 – +150 °C (+ 32 – + 302 °F) (White cell) 0.8 bar – 2 bar (abs)/ 11.6 psi – 29 psi (abs) ± 0.25% of reading or 100 ppm-v H2S (whichever is greater) ± 0.25% of reading or 3 ppm-v HCl (whichever is greater) 0.8 bar – 3 bar (abs)/ 11.6 psi – 43.5 psi (abs) Typically <1 hour H2S in N2 1% to O% in < 4 sec 1 second 20 ppm-v Better than 1% Typically <1 hour 0.6 ppm-v Better than 1% Better than 1% Linearity 2% of reading or 20 ppm (whichever is greater) 2% of reading or 0.6 ppm (whichever is greater) 2% of reading or 1000 ppm (whichever is greater) 20 ppm-v 0 –50% Accuracy 0 – 1% 0.6 ppm-v 0 – 100% (CO2 and CO) Probes: 200, 400 mm, 800 mm (3.94", 7.87", 15.75") Wafer Cell: 104 mm, 110 mm, 154 mm, 164 mm, 214 mm (4.09", 4.33", 6.06", 6.46", 8.43") Extractive cells: 200, 400, 800, 1 m, 10 m (7.87", 15.75", 31.49", 39.37", 393.70") HCl (ppm) Lower Dectection Limit (in 1 meter path 1000 ppm-v (CO2) length at ambient standard conditions, 1500 ppm-v (CO) dry gas, no dust load, in N2 back­ ground) Measurement range and standard conditions (ambient temperature and pressure, 1 m path length) Optical path length CO2 %/ CO % Measurement (All measurement specifications with reference to standard conditions T & P with no dust or particulates) Electrical inputs & outputs Number of direct outputs (analog) 2 (optional) Laser Spectrometer GPro 500 WARNING: Do not connect the M400 and the direct passive analog outputs at the same time. Current outputs Passive 4…20 mA outputs, galvanically isolated, alarms to 3.6 mA or 22 mA conform to NAMUR NE43 guidelines Measurement error through analog outputs Non-linearity <± 0.002 mA over the 1 to 20 mA range Offset error <± 0.004 mA (zero scale) Gain error <± 0.04 mA (full scale) Analog output configuration Linear Load Max 500 Ohms Hold mode input Yes, via Ethernet (using the MT-TDL Suite) Hold state Automatic (when Ethernet port in use, during calibration): last, fixed or live Communication interface RS 485 (to M400) Service interface Ethernet (to PC) as direct service interface for FW updates (not using the M400 transmitter), for off-line diagnostics and configuration database up- and download Memory slot interface* SD card reader/writer for data retrieval (measurement & diagnostics), FW update (via SD card swap) and remote diagnostics (configuration file up/download) (to be accessed inside the housing). Space for data storage: 4 GB. * Note: For ATEX and IECEx versions the TDL head must not be opened. Analog inputs 2 x 4...20 mA for pressure and temperature (optional: calculated values) Display on M400. Power supply 24 VDC, 5 W minimum Calibration Calibration (factory) Full calibration Calibration (user) One-point and process calibration Operating conditions Ambient temperature range – 20 … + 55 °C (– 4 … +131 °F) during operation; – 40 … + 70 °C (– 40 … +158 °F) during transport and storage (< 95 % non-condensing humidity) Temperature & pressure compensation Using analog 4 … 20 mA input signals or manually set values in M400 compensation (menu configure / measurement. Automatic plausibility check of analog inputs Installation Warm up time 28 1 hour Instrument side purging Instrument side purging (for space between TDL window and process window) All process adaptions (SP and NP probes, wafer and extractive cells) require instrument-side purging. For oxygen applications, nitrogen with a purity > 99.7% (minimum recommended) at a flow rate of about < 0.5 l/min (application dependent) is required. For other gas applications, instrument grade air can be used instead of nitrogen. All purge gases should be clean/dry and conform to standard ISO 8573.1. class 2 3, for Instrument air quality. Data logger Function Logging of all sensor data on SD card Interval See chapter 6.3.3 (Data logging) on page no 87. Format SPC Table 2 Product data probe Size and weight Probe lengths Please see chapter 4 (Dimensions and Drawings) on page no 43. Weight – 4 – 6 kg, depending on length (SP, NP, E process adaptions) – 10 – 15 kg, depending on diameter (wafer cells) Material of construction Steel (medium-wetted) 1.4404 (comparable to 316L), 1.4571 steel, C22 Hastelloy Optical elements AR coated Quartz, AR coated Borosilicate Seals Kalrez® 6375, Graphite compounds Instrument cover (Blue) Aluminum – Paint finish – Chemically resistant epoxy resin coating Other materials of construction as well as different probe lengths are available upon request. Instrument side purging Process side purging – For purged (SP) and wafer (W) For standard purged (SP) and wafer (W), a process side purge is normally required. For oxygen applications, nitrogen with a purity > 99.7% (minimum recommended) at a flow rate of between 0.5 and 10 l/min (application dependent) is required. For other gas applications, instrument grade air can be used instead of nitrogen. All purge gases should be clean/dry and conform to standard ISO 8573.1. class 2 3, for Instrument air quality. WARNING: Check valve is required (not provided with GPro 500 – see "Accessories" on page no 126). Corner cube purging (for standard purged (SP) and wafer (W) Yes, via process side purging 29 Operating conditions Laser Spectrometer GPro 500 Temperature range 0… +250 °C (+ 32 … +482 °F) optional: 0… +600 °C (+ 32 … 1112 °F) with additional Thermal Barrier and graphite gaskets. Design Pressure (see measurement table max. pressure: 20 bar (290.1 psi) Process adaptor for maximum operating pressure for dependent specific gases) Max. dust load @ nom. OPL Application dependent Ambient temperature range –20 … +55 °C (– 4… +131 °F) during operation; –40 … +70 °C (– 40 … +158 °F) during transport and storage (< 95 % non-condensing humidity) Installation Probe Flange size DN50/PN25, DN50/PN16, DN80/PN16, ANSI 2”/300lb, ANSI 2”/150lb, ANSI 3”/150lb. See Figure 22 till Figure 27 for further details. Required gasket for proper flange sealing (not provided with GPro 500 – see Appendix chapter 2.3 (Accessories) on page no 126. Dimension: 82.14 x 3.53 mm Table 3 Product data M400 Electrical inputs & outputs Communication interface RS 485 (to sensor head) Analog outputs 4 x 4...20 mA (22 mA): process temperature, pressure, % conc, % transmission (on M400) Relays 6 relays (on M400) Power supply 24 VDC or 85...250 VAC, 50 / 60 Hz @100 VA Fuse 10 A slow ISM diagnostics parameters % Transmission Available as a 4 … 20 mA analog output Window fouling Time to Maintenance Indicator (TTM). Real time, dynamic prediction of when the next maintenance cycle is required for best operation. Action: Clean the optics (window, corner cube) Laser lifetime Dynamic Lifetime Indicator (DLI). Based on the DLI information, the transmitter tells you when it’s time to replace the TDL. Action: Replace TDL (Expected laser diode lifetime >10 years) Alarms triggers 30 Too low transmission Min. transmission value to be set in M400 menu Config / ISM setup Other All alarms (incl. SW/HW errors etc.) are listed in Chapter 8.5.1 of the M400 manual. 2 Preparations 2.1 Tools and other equipment The following tools are necessary to install GPro 500: • 2 pcs open-end spanners for M16 bolts • 1 pcs Allen key 5 mm for the locking screws on flanges and Tx lid screws • 1 pcs Allen key 3 mm for the RS 232 cover screws • 1 pcs flat screwdriver 2.5 mm for electrical connections • 1 pcs flat (6 mm) or cross head (No 2) screwdriver for Rx lid screws • Adjustable wrench for purge connections Other equipment necessary, not supplied my METTLER TOLEDO: • Check valve • Process side gasket (99 x 2.62 mm) 2.2 Flow conditions at measuring point When deciding the placement of the GPro 500 TDL in the process, we recommend a minimum of 5 pipe diameters of straight duct before and 3 pipe diameters of straight duct after the point of measurement. This will lead to laminar flow conditions which is favorable for stable measurement conditions. 2.3 Measuring head placement (probe installations) The TDL head should be easily accessible. A person should be able to stand in front of it and adjust the M16 fixing bolts using two standard spanners. There should be at least 60 cm free space measured from the flange fixed to the stack and outwards as shown below. 60 cm (23.6") 60 cm (23.6") Figure 5 Minimum free space at the process flange. 31 Laser Spectrometer GPro 500 US Version: Installation in a Division 1 area requires conduit as well as cable glands approved for the area. The explosionproof probe head will need final adjustment which requires movement of the probe head. To faciliate this, you will need to provide and install an explosionproof flexible coupling (for example: Killark ECF/EKJ) in close proximity to the probe head. The coupling needs to be long enough and installed within your conduit system to minimize vibration and to faciliate final adjustment of the probe head which may include rotation by max. ± 90 degrees. Please be sure to provide a coupling which is suitably long. 2.4 Flanges and stack hole requirements (Probe installations) The probe requires one hole, at least 54 mm in diameter. Standard flange used for connection is DN50/ PN25 or ANSI 2“/300 lb. The flange can either be welded directly to the process, or optionally be part of a bypass system The two flanges are shown in Dimensions of the DN50/PN25 flange for standard purge probe (SP) and non-purged probe (NP) on page no 30. When the process flange is mounted it is important that the free space in front of it is at least 60 cm to facilitate installation and maintenance. Se Minimum free space at the process flange. on page no 31. Gasket is not provided. See chapter Table 1 (Product data sensor head) on page no 24 for information on suitable gaskets. 2.5 Cables and electrical connections The TDL and M400 are connected with a RS 485 cable. The user should verify that the cable length for the 4–20 mA analogue current output from the TDL does not influence the measurements (due to inductance etc.). If electrical connections have to be made at installation, refer to chapter 5 (Electrical Connections) on page no 67, 5M cable length statement. ATEX Version: WARNING The GPro 500 comes with a pre-installed cable and cable gland. Do not attempt to replace the cable as it will void the warranty and violate the ATEX classification! RS 485 cable specifications for the ATEX version: Lead area must be at least 0.5 mm2 and the maximum length is 200 m. The specification for the Ethernet cable is CAT5. 32 US Version: The FM version must be installed using a suitable cabling conduit system in accordance with local codes and regulations. To aid installation, the unit is supplied without an attached cable. WARNING The electrical installation must be performed in accordance with National Electrical Codes of practise and/or any other applicable national or local codes. 33 3 Installation and Start-up Laser Spectrometer GPro 500 This chapter describes the steps and measures needed to be taken during commissioning of the GPro 500. 3.1 Installation and adjustments 3.1.1 Mechanical installation The GPro 500 is designed to be very easy to install. The optical path is aligned in the factory so the installation procedure is simply to bolt it to the process flange, mount the purging tube (6 mm or optional 1/4" tube fitting) and mount the cables. For efficient installation you must make sure that the pre-installation requirements are met prior to the visit of the Mettler-Toledo technician. For purged (SP) probes and purged wafer (W) cells, if the process is running or if the optical surfaces will be exposed to contaminates or condensates following initial installation, it is essential to connect and turn on the process purge. It is recommended to initially run the purge gas at maximum flow (typically 10 l/min) to protect the optics. This flow will be adjusted and optimized later during final measurement setup. 3.1.2 Process side purging (not applicable to non-purged probe [NP] and ­extractive cell [E]) Depending on the type of process adaptor supplied, there may be requirement for either one or two ­optical purges. These are called Instrument purge and Process purge. Figure 7 on page 37 and Figure 9 on page 38 provides further details on the purge requirements for the standard purge (SP) probe together with the typical configuration of the required external flowmeters (rota meters) used to supply and control the purge gas flow. Purge and non purge Probes without filter. If installing an SP or NP probe without filter, ensure that the holes/slots are facing the process (verify that the flat gasket between the probe and the sensor head is well installed) and ensure the flange gasket is in place. Non-purged with filter Prior to inserting an NP probe with an installed filter, mark the position/angle of the DUST SHIELD on the flange. When installing the probe, ensure that the DUST SHIELD is facing the process in coming flow and ensure the flange gasket is in place. Instrument Purge The GPro 500 TDL head attaches to the process adaptor via a precision mechanical interface. Between the optical window of the TDL head and the adaptor’s process window, there is a small cavity. This cavity forms part of the optical path of the analyzer and therefore it is important that there are no traces of the gas to be measured, i.e. O2 or H2O or other, in this space, otherwise this will add to the measurement concentration. The instrument purge is therefore used to flush this space. In addition, in the unlikely event of a breakage of the process window, the purge will flush process gas away from the cavity. Typical purge gas flow for instrument purge is < 1 l/min Note: All current process adaptor types require instrument purge. 34 Process Purge For standard purged (SP) probes and purged in-line wafer (W) cells, in addition to the instrument purge described above, these also utilize a process purge to protect the optical windows from direct contact with process gas. The process purge flow is adjusted during commissioning to provide sufficient flow to provide this protection and to set the optical path length through the probe. Note. Process purge is critical for the protection of the process wetted optical components and for correct operation of the analyzer and therefore must be running at all times. For oxygen applications nitrogen purge is required, or alternatively another clean, non-explosive, noncorrosive and dry O2 free gas. For other gas measurements, instrument grade air is normally recommended. The GPro 500 standard purged probes (SP) and purged wafer cells (W) are designed to consume as little purge gas as possible while still keeping the process optical surfaces clean. When bulk plant nitrogen (or instrument air for non O2 measurements) is not available gas cylinders can alternatively be be used. The purge consumption during normal operation is less than 1 l/min. which means that if you have ten bottles with 3300 Std Liters (Liters of gas when at “standard” room temperature and pressure) filled to 2500 psi (172 bar), which is typically large bottles, they will last at least 3 weeks. Process purge gas consumption rarely exceeds 5 l / min. The purging of the probe optics is essential to avoid contamination of the probe optics during process operation. After installation ensure that purging is operating before you start the process. The details are described in chapter 3 of the operating instructions. WARNING Always start purging at maximum flow before starting the process. WARNING Purging must always be switched on in order to avoid dust and / or condensate deposition onto the optical surfaces. Another alternative is to use a nitrogen generator (for O2 applications) local compressed air supply (for CO and H2O applications), as long as it is oil free and non condensing and meets the quality requirements laid out in ISO 8573.1, class 2–3, for instrument air. The purging is attached to the 6 mm (optional 1/4") Tube Fitting. The purge gas then exits in front of the first window and in front of the corner cube at the end of the probe see Figure 6 (Optimizing the purge flow) on page no 36. WARNING The purge gas inlet for the process side must have a check valve to avoid contamination of the purging system from process gas. WARNING Always start purging at maximum flow before starting the process. WARNING Purging must always be switched on in order to avoid dust deposition onto the optical surfaces. 35 WARNING Do not connect instrument and process side purging in series, otherwise when disassembling the sensor heat the probe purging will stop. 3.1.3 Adjusting the purging flow (for standard purged [SP] and in-line wafer [W] cells) The flow rate of the purging will affect the effective path length and consequently the measurement value. Therefore the following procedure should be used. Start with a very high flow rate and gradually decrease it. The measurement value will then start at a low value and increase with decreasing purge flow. At some point it will level out and stay constant for a while and then again start increasing. Choose a purge flow in the middle of the constant region. CAUTION If the process flow rate remains constant this will be a good purge flow but the effective path length will always be a function of the process flow rate so be observant on this. 3 Inecreased reading Laser Spectrometer GPro 500 WARNING Do not remove and / or disassemble the purge gas inlet for processes (2). If disassembled, the PED pressure certificate is void. 2 4 1 Decreasing purge flow Figure 6 Optimizing the purge flow On the x-axis there is purge flow and on the y-axis there is the instrument concentration reading. 1 Concentration reading with high purge flow. The path length is now shorter than the effective path length since the purge tubes is completely filled with purging gas and some of the purging gas is flowing into the measurement path. 2 Concentration reading with optimized purge flow. The path length is now equal to the effective path length since the purge tubes are completely filled with purge gas. See the illustration below. 3 Concentration reading with no purge flow. The path length is now equal to the nominal path length since the probe is completely filled with process gas. 4 The optimized purge flow. 36 3.1.4 Signal Optimization When in installation mode, the current value of % transmission and the noise signal level (NSL) will be displayed for 5 minutes on the M400 transmitter display, before automatically returning to measurement mode. These two diagnostics values aid in optimizing the laser signal quality. This is accomplished by loosening the securing clamp and slowing rotating the blue TDL head. Continue to rotate the head until the NSL value is less than 40 and the transmission value is above 70%. Finally fully tighten the clamp and confirm the values are still acceptable. (See "TDL Installation" on page no 41 for further details). WARNING The GPro 500, when fitted with the standard purged (SP) probe, can not operate in process conditions where process gas stream velocity is typically <1 m/s. This would make the effective path length (see "Dimensions and Drawings" on page no 43) too variable. For applications with sample flows <1 m/s, an in-line wafer cell option is available. For static processes where the process gas is clean and dry (non-condensing), for example; tank head space measurement, a non-purge probe option is available. 2 4 1 6 3 Zone 1 Zone 0 5 Figure 7 Purging configuration for standard purged probe (SP) 1 2 3 4 5 Purge gas inlet for instrument side (6 mm Tube Fitting for DIN, ¼" for ANSI versions) Purge gas inlet for process side (must have a check valve to be supplied by the user) Purge gas outlet for instrument side (6 mm Tube Fitting for DIN, ¼" for ANSI versions) Mandatory check valve (to be supplied by the user) Process gas flow 6 Cut-off zone: region that defines the boundaries of the effective path length. See "Adjusting the purging flow (for standard purged [SP] and in-line wafer [W] cells)" on page no 36. ≠ 37 Laser Spectrometer GPro 500   The process side purge connection is fitted with a seal between the fitting and the purge h­ ousing to conform to the pressurized equipment directive (PED). To ensure the integrity of this seal and to prevent damage when connecting the purge tube to the fitting, a back spanner (wrench) must be used to securely hold the fitting body as the purge pipe nut is tightened, as illustrated in Figure 8 below. Figure 8 Connecting purge pipe to process side purge fitting. WARNING Do not remove and / or disassemble the purge gas inlet for process (2). If disassembled, the PED pressure certificate is void. 0…1 L /min 0…10 L /min Pressure regulator Rotameter Figure 9 Purge gas rotameter connections for standard purge (SP) probe 1 2 3 4 5 38 Purge gas inlet for instrument side (6 mm or ¼" tube fitting). Purge gas inlet for process side (must have a check valve). Purge gas outlet for instrument side (6 mm or ¼" tube fitting). Process gas flow. Region that defines the boundaries of the effective path length. WARNING Always start purging at maximum flow before starting the process. WARNING Purging must always be switched on in order to avoid dust deposition onto the optical surfaces. WARNING Do not remove and / or disassemble the purge gas inlet for processes (2). If disassembled, the PED pressure certificate is void. WARNING Do not connect instrument and process side purging in series, otherwise when disassembling the sensor heat the probe purging will stop. WARNING Instrument side purging must be sufficient in order to maintain the temperature of the sensor head below the maximum acceptable limit of < 55 °C (< 130 °F). WARNING When the process gas stream is on, the instrument side purging must always be on in order to avoid possibility of ingress of process gas stream into the sensor head in the unlikely event of a TDL sensor head window failure. 3.1.5 Solar radiation and process radiated heat. Exposure of the TDL head to very high temperatures, for example, solar radiation and/or excessive localised heat sources (such as radiated heat from process walls or adjacent equipment) can cause internal overheating of the device. It is therefore important under these circumstances that adequate protection is provided, either in the form of a solar shield/roof for solar protection, or a suitable heat shield in the case of excessive radiated heat from nearby processes or equipment. If the TDL is exposed to excessive heat for prolonged periods, under these extreme circumstances the measurement may be withdrawn and the TDL will display a laser source error message. If this should occur, the device should be allowed to cool to its normal operating temperature range and suitable remedial measures made to prevent further overheating occurring. Should the sensor head be exposed to excessive high temperatures beyond the specification, the laser may shutdown, and a laser source error message may be indicated. If this should occur, power should be disconnected and the sensor head allowed to cool before restarting the device. Note: The solar shield/roof should not enclose the TDL head, as a free flow of air should be allowed to circulate at all times. 39 Laser Spectrometer GPro 500 3.2 Alignment The GPro 500 is carefully aligned when it leaves the factory and normally doesn’t require any alignment during normal use. If misalignment is suspected you need to contact Mettler Toledo or you local supplier (see Sales and Service on page no 130) and send the GPro 500 back to the factory for re-alignment. When the GPro 500 sensor head is removed from the probe (or from the thermal barrier should this be installed), for example for verification and/or inspection, it is not necessary to realign it when mounting it back onto the probe (or heat barrier). However, we should recommend to turn the head until the maximum transmission is reached. Consult the M400 manual on how to see the live transmission value on its display. 3.2.1 Signal Optimization Note that when in installation mode, the current value of % transmission and the noise signal level (NSL) will be displayed for 5 minutes on the M400 transmitter display, before automatically returning to measurement mode. These two diagnostics values aid in optimizing the laser signal quality. This is accomplished by loosening the securing clamp and slowing rotating the blue TDL head. Continue to rotate the head until the NSL value is less than 40 and the transmission value is above 70%. Finally fully tighten the clamp and confirm the values are still acceptable. (See "TDL Installation" on page no 41 for further details). WARNING The purge gas for the thermal barrier must always be turned on when the process is running in order to protect the sensor head from permanent damage. WARNING The failure of the instrument side and thermal barrier purging system must trigger an alarm. This alarm has to be implemented in th DCS ny the user. 40 3.3 Installation & Commissioning General Setup (applies for all parameters) (PATH: Menu / Quick Setup) While in Measurement mode press the [MENU] key to bring up the Menu selection. 20.9 %V O ­Select QUICK SETUP and press the [ENTER] key. 25.0 °C MENU u Quick Setup Display Convention: 1st line on display ➝ a 3rd line on display ➝ c 4th line on display ➝ d 2nd line on display ➝ b 2 Select the units of measurement for a and b. Only lines a and b can be configured in Quick Setup. Go to the Configuration Menu to configure lines c and d. Channel Selection Please select the type of Sensor: A 6.0 pH Analog: For conventional analog sensors (will be displayed on channel “A”). A 25.0 °C Channel Select=ISM ISM: For ISM sensors (will be displayed on channel ”B”). u Parameter=Auto Please select the parameter requirement: The choice of parameter depends on the level of transmitter. If an ISM sensor is selected, the setting “Auto” means, all possible ISM sensors will be recognized and accepted. If a special parameter is chosen, only this parameter will be recognized and accepted on the transmitter. Calibration The GPro 500 is calibrated at the factory and does not require calibration at installation & Startup. TDL Installation (path: Quick Setup / TDL / Installation) While in measurement mode press the key [MENU] . Press the m or . key to select the TDL B 20.9 %V O and then the Installation menu item. B 20.9 %Trm 2 MENU Quick Setup u In this mode, the current value of % transmission and the noise signal level (NSL) will be B 20.9 %V O displayed for 5 minutes before automatically returning to measurement mode. These two B 20.9 %Trm Transmission Signal diagnostics values aid in optimizing the laser signal quality. This is accomplished by loosenu 021 % ing the securing clamp and slowing rotating the blue TDL head. Continue to rotate the head until the NSL value is less than 40 and the transmission value is above 70%. Finally fully tighten the clamp and confirm the values are still acceptable. In this position, and secure the blue sensor head into position and tighten the clamp. 2 TDL Commissioning (path: Quick Setup / TDL / Commissioning) B 20.9 %V O While in measurement mode press the key [MENU] . Press the m or . key to select the TDL B 20.9 %Trm O –TDL and then the Commissioning menu item. u Commissioning 2 2 First, select the type of pressure compensation selected: – External: current external pressure value coming from a pressure transducer of 4.. 20 mA analog output – Fixed: pressure compensation uses a fixed value to be set manually. Note: if this pressure compensation mode is selected, a considerable gas concentration measurement error resulting from a non- realistic pressure value can 41 take place. If External compensation is selected, then the minimum (4 mA) and maximum (20 mA) B 20.9 %V O analog output signals from the pressure transducer must be mapped to the corresponding B 20.9 %Trm Analog input of the TDL. Key in the minimum and maximum values of the pressure in the u Pressure=External following units: – hPa – mmHg – mbar – psi – kPa Laser Spectrometer GPro 500 2 In general, METTLER TOLEDO recommends the use of absolute pressure transducers for more B 20.9 %V O accurate signal compensation over a broad pressure range. B 20.9 %Trm 2 Ain 4 mA = 940.0 mbar Ain 20 mA = 2000. mbar u If, however, small pressure variations around atmospheric pressure are to be expected, relative pressure sensors will produce better results; but the variations of the underlying barometric pressure will be ignored. For relative pressure sensors, the minimum and maximum values must be mapped so that the TDL can interpret the analog pressure signal as “absolute”, i.e. a fixed barometric pressure of 1013 mbar (for example) has to be added to the mapped values. If Fixed compensation is selected, the fixed pressure value with which the measurement B 20.9 %V O signal will be calculated has to be keyed in manually. For the fixed pressure, the following B 20.9 %Trm units can be used: u Pressure=fixed – hPa – mmHg – mbar – psi – kPa 2 B B 20.9 %V O 20.9 %Trm Pressure=1013. mbar 2 u If External compensation is selected, then the minimum (4 mA) and maximum (20 mA) B 20.9 %V O analog output signals from the temperature transducer must be mapped to the corresponding B 20.9 %Trm Analog input of the TDL. Key in the minimum and maximum values of the temperature in °C. u Temperature=External 2 B 20.9 %V O B 20.9 %Trm 2 Ain 4 mA = 0.000 °C Ain 20 mA = 250_0 °C u If Fixed compensation is selected, the fixed temperature value with which the measurement B 20.9 %V O signal will be calculated has to be keyed in manually. For the fixed temperature, only °C can B 20.9 %Trm be used. u Temperature=Fixed 2 B 20.9 %V O B 20.9 %Trm 2 Temperature=320.0 °C u Last, select the initial optical path length corresponding to the probe length installed: B 20.9 %V O B 20.9 %Trm Please see Table 4 (Installation examples) on page no 62 for details of the applicable OPL value for the process adaptor type being installed. u Pathlength=00200 mm 2 This initial value is valid when instrument purging on the instrument and on the process side is running. Depending on the process conditions and after the optimum of the process purging flow has been found (see next chapter), this value may have to be slightly adapted. 42 4 Dimensions and Drawings 4.1 Standard purged probe (SP) The GPro 500 is available with 3 different probe lengths. It can also be supplied with various flange sizes to suit the installation (see page 44 for flange dimensions). This will increase the number of available applications where the GPro 500 will fit smoothly. The dimensions of the TDL heads as well as of the flanges and the thermal barrier are shown below. There are four different lengths that should be observed. The most relevant from the standpoint of measuring performance is the Effective path length. 175,5 mm (6.91") 3 4 1 2 115 mm (4.52") D = ¼" or 6 mm f 119 mm (4.68") 300 mm (11.81") ½" NPT  50 mm (± 0,3 mm) (1.97" [± 0.01"]) Figure 10 Dimensions of the standard probe (SP) Definition of the lengths: ➊ Nominal path length, the default length when GPro 500 is delivered. It corresponds to the effective path length without purging. ➋ Probe length, the physical length of the probe. ➌ Insertion length, part of the probe that has to protrude into the pipe for effective purging. ➍ Effective path length, when configuring the GPro 500 with the M400, the double value of the effective path length must be keyed in (2x effective path length). 43 Laser Spectrometer GPro 500 Probes, wafer and cell dimensions Standard purged probe (SP) OPL 44 Standard purged (SP) Standard purged (SP) Standard purged (SP) 200 mm (7.9") 400 mm (15.7") 800 mm (31.5") Dimension ➊ Dimension ➋ Dimension ➌ Dimension ➍ 138 mm (5.4") 238 mm (9.4") 438 mm (17.2") 288 mm (11.3") 388 mm (15.3") 588 mm (23.1") 161.5 mm (6.4") 261.5 mm (10.3") 461.5 mm (18.2") 100 mm (3.9") 200 mm (7.9") 400 mm (15.7") * Note: D  imension ➋ in above table applies for standard 100 mm stand-off. For total probe length dimensions for other stand-off lengths, please refer to product configurator. 4.2 Non-purged probe (NP) with filter 175,5 mm (6.91") D = 6 mm or ¼" 269 mm (10.59") ½" NPT 3 1 4 2 120 mm (4.72") f  50 mm (± 0,3 mm) (1.97" [± 0.01"]) Figure 11 Dimensions of the non-purged probe (NP) with filter. Definition of the lengths: ➊ Nominal path length, the default length when GPro 500 is delivered. It corresponds to the effective path length without purging. ➋ Probe length, the physical length of the probe. ➌ Insertion length, part of the probe that has to protrude into the pipe for effective purging. ➍ Effective path length, when configuring the GPro 500 with the M400, the double value of the effective path length must be keyed in (2x effective path length). 45 Laser Spectrometer GPro 500 Probes, wafer and cell dimensions Non-purged probe (NP) with OPL filter 46 Non-purged probe (NP) Non-purged probe (NP) Non-purged probe (NP) 200 mm (7.9") 400 mm (15.7") 800 mm (31.5") Dimension ➊ Dimension ➋ Dimension ➌ Dimension ➍ 138 mm (5.4") 238 mm (9.4") 438 mm (17.2") 288 mm (11.3") 388 mm (15.3") 588 mm (23.1") 161.5 mm (6.4") 261.5 mm (10.3") 461.5 mm (18.2") 138 mm (5.4") 238 mm (9.4") 438 mm (17.2") * Note: D  imension ➋ in above table applies for standard 100 mm stand-off. For total probe length dimensions for other stand-off lengths, please refer to product configurator. 4.3 Non-purged probe (B) with Blow-Back 175,5 mm (6.91") 269 mm (10.59") ½" NPT 3 1 4 2 120 mm (4.72") D = 6 mm or ¼" f  50 mm (± 0,3 mm) (1.97" [± 0.01"]) Figure 12 Dimensions of the non-purged probe (B) with Block-Back. Definition of the lengths: ➊ Nominal path length, the default length when GPro 500 is delivered. It corresponds to the effective path length without purging. ➋ Probe length, the physical length of the probe. ➌ Insertion length, part of the probe that has to protrude into the pipe for effective purging. ➍ Effective path length, when configuring the GPro 500 with the M400, the double value of the effective path length must be keyed in (2x effective path length). 47 Laser Spectrometer GPro 500 Probes, wafer and cell dimensions Non-purged probe (NP) with OPL blow-back 48 Non-purged filter probe with blow-back (NB) Non-purged filter probe with blow-back (NB) Non-purged filter probe with blow-back (NB) 200 mm (7.9") 400 mm (15.7") 800 mm (31.5") Dimension ➊ Dimension ➋ Dimension ➌ Dimension ➍ 138 mm (5.4") 238 mm (9.4") 438 mm (17.2") 288 mm (11.3") 388 mm (15.3") 588 mm (23.1") 161.5 mm (6.4") 261.5 mm (10.3") 461.5 mm (18.2") 138 mm (5.4") 238 mm (9.4") 438 mm (17.2") * Note: D  imension ➋ in above table applies for standard 100 mm stand-off. For total probe length dimensions for other stand-off lengths, please refer to product configurator. 4.4 Configuring Blow-back function When using the non-Purge probe with blow-back (NB), a suitable N2 or instrument air supply can be connected to the probe blow-back port. A suitable solenoid valve can then be connected to the M400 Transmitter, relay 1 connections (as detailed below) to initiate blow-back on a timed basis. This is configured through the M400 interface: Menu/Configure/Alarm/clean Select clean and relay #1. Press ENTER. Select clean interval (period between cleaning cycles) and clean time (how long the solenoid valve is activated). Press ENTER. Select relay normal or inverted mode and finally save settings. Blow-back will now be initiated automatically at the configured schedule. 49 Laser Spectrometer GPro 500 Figure 13 B probe with blow-back using M400 (DC solenoid valve). 50 Figure 14 B probe with blow-back using M400 (AC solenoid valve). 51 4.5 Wafer (W) ½" NPT 6 mm (DN) or ¼" (ANSI) Pipe stubs 4 DIN 50, DIN 80, DIN 100, ANSI 2", ANSI 3", ANSI 4" 6 mm (DN) or ¼" (ANSI) Swagelok bored-through (BT)  165,  200,  235 mm,  168,  192,  250 mm ( 6.50",  7.87",  9.25",  6.61",  7.56",  9.84") 25 mm (0.98") 1 37,5 mm (1.48") 32 mm (1.26") G ¼" 173 mm, 220 mm, 250 mm (6.81", 8.66", 9.84") Laser Spectrometer GPro 500 175,5 mm (6.91") 3 Figure 15 Dimensions of the wafer (W). Definition of the lengths: ➊ Nominal path length, the default length when GPro 500 is delivered. It corresponds to the effective path length without purging. ➌ Insertion length, wafer thickness (distance between pipe flanges).. ➍ Effective path length, when configuring the GPro 500 with the M400, the double value of the effective path length must be keyed in (2x effective path length). 52 Probes, wafer and cell dimensions Wafer (W) OPL DN 50 wafer (W) DN 80 wafer (W) DN 100 wafer (W) ANSI 2" wafer (W) ANSI 3" wafer (W) ANSI 4" wafer (W) 110 mm (4.33") 164 mm (6.46") 214 mm (8.43") 104 mm (4.09") 154 mm (6.06") 214 mm (8.43") Dimension ➊ Dimension ➋ Dimension ➌ Dimension ➍ 79 mm (3.11") 121 mm (4.76") 157 mm (6.18") 77 mm (3.03") 99 mm (3.90") 157 mm (6.18") n.a. 54 mm (2.13") 54 mm (2.13") 54 mm (2.13") 54 mm (2.13") 54 mm (2.13") 54 mm (2.13") 55 mm (2.17") 82 mm (3.29") 107 mm (4.21") 52 mm (2.05") 77 mm (3.03") 107 mm (4.21") n.a. n.a. n.a. n.a. n.a. * Note: D  imension ➋ in above table applies for standard 100 mm stand-off. For total probe length dimensions for other stand-off lengths, please refer to product configurator. 53 4.6 Extractive cell (E) 150 mm (5.90") 35 mm 35 mm 1 D = 6 mm or ¼" (BT) 40 mm (1.57") T-Sensor 2 4 442 mm (17.40") Gas In (1.37") (1.37") ½" NPT Instrument Purge Laser Spectrometer GPro 500 175,5 mm (6.91") P-Sensor 71 mm (2.79") Gas Out 61 mm (2.40")  20 mm (0.78")  50 mm (1.96") Figure 16 Dimensions of the extractive cell (E). Definition of the lengths: ➊ Nominal path length, the default length when GPro 500 is delivered. It corresponds to the effective path length without purging. ➋ Probe length, the physical length of the probe. ➍ Effective path length, when configuring the GPro 500 with the M400, the double value of the effective path length must be keyed in (2x effective path length). 54 Probes, wafer and cell dimensions Extractive cell (E) OPL Extractive cell (E) Extractive cell (E) Extractive cell (E) Extractive cell (E) 200 mm (7.9") 400 mm (15.7") 800 mm (31.5") 1000 mm (39.4") Dimension ➊ Dimension ➋ Dimension ➌ Dimension ➍ 125 mm (4.92") 225 mm (8.86") 425 mm (16.73") 525 mm (20.67") 232 mm (9.13") 332 mm (13.07") 532 mm (20.94") 632 mm (24.88") N.A N.A N.A N.A N.A N.A N.A N.A 125 mm (4.92") 225 mm (8.86") 425 mm (16.73") 525 mm (20.67") * Note: D  imension ➋ in above table applies for standard 100 mm stand-off. For total probe length dimensions for other stand-off lengths, please refer to product configurator. 55 4.7 Extractive Probe Dual Window 150 mm (5.90") 1 (1.37") (1.37") 2  50 mm (1.97") 4 D = 6 mm or ¼" (BT) 238 mm (9.37") 35 mm 35 mm ½" NPT 40 mm (1.57") Laser Spectrometer GPro 500 175,5 mm (6.91")  20 mm (0.78") 61 mm (2.40") (1.37") (1.37") 35 mm 35 mm 71 mm (2.79") Figure 17 Dimensions of the extractive dual window. Definition of the lengths: ➊ Nominal path length, the default length when GPro 500 is delivered. It corresponds to the effective path length without purging. ➋ Probe length, the physical length of the probe. ➍ Effective path length, when configuring the GPro 500 with the M400, the double value of the effective path length must be keyed in (2x effective path length). 56 Probes, wafer and cell dimensions Extractive cell Dual Window (E) OPL Extractive cell Dual Window(E) Extractive cell Dual Window(E) Extractive cell Dual Window(E) 400 mm (15.7") 800 mm (31.5") (1000 mm (39.4") Dimension ➊ Dimension ➋ Dimension ➌ Dimension ➍ 200 mm (7.9") 400 mm (15.7") (500 mm (19.7") 321 mm (12.6") 521 mm (20.5") (621 mm (24.4") N.A N.A N.A N.A N.A N.A 200 mm (7.9") 400 mm (15.7") (500 mm (19.7") * Note: D  imension ➋ in above table applies for standard 100 mm stand-off. For total probe length dimensions for other stand-off lengths, please refer to product configurator. 57 4.8 Extractive Cell PFA 150 mm (5.90") 35 mm (1.38") ½" NPT 120 mm (4.72") Laser Spectrometer GPro 500 175,5 mm (6.91") 49 mm (1.92") PFA, D = 6 mm or ¼" (BT) 40 mm (1.57") 2 1 4 78 mm (3.07")  20 mm (0.78")  50 mm (1.96") Figure 18 Dimensions of the extractive cell PFA. Definition of the lengths: ➊ Nominal path length, the default length when GPro 500 is delivered. It corresponds to the effective path length without purging. ➋ Probe length, the physical length of the probe. ➍ Effective path length, when configuring the GPro 500 with the M400, the double value of the effective path length must be keyed in (2x effective path length). 58 Probes, wafer and cell dimensions Extractive Cell PFA OPL Extractive cell (E) PFA 1000 mm (39.4") Dimension ➊ Dimension ➋ Dimension ➌ Dimension ➍ 500 mm (19.7") 606.5 mm (23.9") N.A N.A 500 mm (19.7") * Note: D  imension ➋ in above table applies for standard 100 mm stand-off. For total probe length dimensions for other stand-off lengths, please refer to product configurator. 59 4.9 Extractive White Cell ½" NPT  100 mm (± 0,3 mm) (3.93") (± 0.01") G ¼" G ¼" 4 1 2 Laser Spectrometer GPro 500 175,5 mm (6.91") ( Figure 19 Dimensions of the extractive white cell. Definition of the lengths: ➊ Nominal path length, the default length when GPro 500 is delivered. It corresponds to the effective path length without purging. ➋ Probe length, the physical length of the probe. ➍ Effective path length, when configuring the GPro 500 with the M400, the double value of the effective path length must be keyed in (2x effective path length). 60 Probes, wafer and cell dimensions Extractive White Cell OPL Extractive white cell (E) 10000 mm (393.7") Dimension ➊ Dimension ➋ Dimension ➌ Dimension ➍ 250 mm (9.8") 432 mm (17.0") N.A N.A 250 mm (9.8") * Note: D  imension ➋ in above table applies for standard 100 mm stand-off. For total probe length dimensions for other stand-off lengths, please refer to product configurator. Extractive White Cell Internal Volume OPL Diameter Approx. Volume 200 mm (7.9") 400 mm (15.7") 800 mm (31.5") 98 ml (39.4") 25 mm (1.0") 25 mm (1.0") 25 mm (1.0") 25 mm (1.0") OPL Diameter Approx. Volume 200 mm (7.9") 400 mm (15.7") 800 mm (31.5") 20 mm (0.8") 20 mm (0.8") 20 mm (0.8") 20 mm (0.8") 63 ml 1000 Extractive White Cell Internal Volume 1000 (39.4") Extractive (PFA) Internal Volume OPL 393 ml 491 ml 126 ml 251 ml 314 ml (39.4") Diameter 20 mm (0.8") 20 mm (0.8") 20 mm (0.8") 20 mm (0.8") OPL Diameter Approx. Volume 260 mm (10.2") 55 mm (2.2") 618 ml 200 mm (7.9") 400 mm (15.7") 800 mm (31.5") 1000 White Cell Internal Volume 196 ml Approx. Volume 63 ml 126 ml 251 ml 314 ml 61 Table 4 Installation examples Required flanges for some typical standard probe (SP) configurations (100 mm stand-off) ➊N  ominal ➋ Probe ➌ Insertion ➍ Effective Pipe size DN / SPS Number of flanges 138 mm 288 mm 161.5 mm 100 mm 100 mm 2 (5.4") (11.3") (6.4") (3.9") (3.94") 138 mm 288 mm 161.5 mm 100 mm 150 mm (5.4") (11.3") (6.4") (3.9") (5.91") 138 mm 288 mm 161.5 mm 100 mm 200 mm (5.4") (11.3") (6.4") (3.9") (7.87) 238 mm 388 mm 261.5 mm 200 mm 200 mm (9.4") (15.3") (10.3") (7.9") (7.87") 238 mm 388 mm 261.5 mm 200 mm 250 mm (9.4") (15.3") (10.3") (7.9") (9.84") 238 mm 388 mm 261.5 mm 200 mm 300 mm (9.4") (15.3") (10.3") (7.9") (11.81") 438 mm 588 mm 461.5 mm 400 mm 300 mm (17.2") (23.1") (18.2") (15.7") (11.81") 438 mm 588 mm 461.5 mm 400 mm 400 mm (17.2") (23.1") (18.2") (15.7") (15.75") 438 mm 588 mm 461.5 mm 400 mm 500 mm (17.2") (23.1") (18.2") (15.7") (19.69") 438 mm 588 mm 461.5 mm 400 mm 600 mm (17.2") (23.1") (18.2") (15.7") (23.62") Laser Spectrometer GPro 500 path length length length path length* 2 1 2 2 1 2 2 1 1 * When configuring the GPro 500 with the M400, the double value of the effective path length must be keyed in (23 effective path length). 62 4.10 Standard purged (SP) or non-purge (NP) probe configuration with single flange or dual flange. 100 mm (4") Figure 20 One flange configuration min. clearance: 61.5 mm (schedule 40) min. clearance: 77.5 mm (schedule 80) 100 mm (4") DIN 50 or ANSI 2" DIN 65 or ANSI 2½" Figure 21 Two flange configuration 63 Figure 22 D  imensions of the DN50 / PN25 flange for standard purge probe (SP) and non-purged probe (NP)  165.1 mm (6.5") Figure 23 Dimensions of the ANSI 2" / 300lb flange for standard purge probe (SP) and non-purged probe (NP)  165 mm (6.50") Figure 24 D  imensions of the DN50 / PN16 flange for standard purge probe (SP) and non-purge probe (NP) Figure 25 Dimensions of the ANSI 2" / 150lb flange for standard purge probe (SP) and non-purge probe (NP)  152.4 mm (6.00") 8 x  19 mm (3∕4") (for 3∕4" bolt)  120.6 mm (4.75") 8 x  18 mm (0.71") (for M16 bolt) Figure 26 D  imensions of the DN80 / PN16 flange for standard purge probe (SP) and non-purge probe (NP) Figure 27 Dimensions of the ANSI 3” / 150lb flange for standard purge probe (SP) and non-purge probe (NP)  190.5 mm (7.50")  152.4 mm (6.00")  200 mm (7.87") 8 x  19 mm (3∕4") (for 3∕4" bolt)  160 mm (6.30") 8 x  18 mm (0.71") (for M16 bolt) 64  127 mm (5")  165 mm (6.50")  125 mm (4.92") 8 x  19 mm (3∕4") (for 3∕4" bolt)  125 mm (4.92") Laser Spectrometer GPro 500 8 x  18 mm (0.71") (for M16 bolt) Figure 28 Dimensions of the RF DN100 / PN25 flange for standard purge probe (SP) and non-purge probe (NP)  165.1 mm (6.5")  127 mm (5")  235 mm (9.25") 8 x  19 mm (3∕4") (for 3∕4" bolt)  190 mm (7.48") 8 x  22 mm (0.86") (for M16 bolt) Figure 29 D  imensions of the RF ANSI 4" / 300 lb flange for standard purge probe (SP) and non-purge probe (NP) 4.11 Welded flange dimensions for standard purged (SP) and non-purged (NP) and blow-back (B) probes DIN min. Ø 67 mm min. Ø 54 mm DN100 DN65/PN25 DN65 DN 50     DN50/PN25 100 mm 100 mm For installations where the pipe diameter is not sufficient to accommodate the full probe length, a secondary “blind” flange is required 180° opposite to the entry flange. Fig. 19 shows typical dimensions for such a spool piece suitable for typical DIN 100 or 4" pipe diameters. ANSI min. 2.64" min. 2.12" Note: It is important that the opposing “blind” flange has a larger diameter (as shown). This will accommodated any minor misalignment of the two flanges and allow the probe sufficient clearance 4" ANSI across 2"/300the lbspipe. Under no circumstances should the probe body ANSI lbseither flange be in 2.5"/300 contact with internal wall or the welds. This could distort the probe body, affecting the laser beam integrity. 65 min. Ø 54 mm min. Ø 67 mm DN100 DN50/PN25 100 mm 100 mm Figure 30 Recommended welded flange dimensions (for standard (SP) and non-purged (NP) and blowback (B) probe installations) ANSI min. 2.12" 4" 6 mm tube fittings G ¼" ANSI 2.5"/300 lbs 2.5" Ø30 (1.18") Ø40 (1.57") 2" 40 (1.57") min. 2.64" G ¼" ANSI 2"/300 lbs Flat gasket HT (see Appendix 2) 100 (3.94") Figure 31 Dimensions of the thermal barrier. 4" 66 DN65/PN25 DN65 DN 50     Laser Spectrometer GPro 500 DIN 4" Flat gasket ST (see Appendix 2) 5 Electrical Connections ATEX Version: Most of the electrical connections are terminated at the junction box. All potentials are floating and none of them should be grounded to the box. This applies to all connection tables. WARNING Ensure that the electrical installation of the TDL conforms to all applicable local and national electrical safety requirements. WARNING Obey the safety instructions given below when you install the TDL; if you do not, the TDL certification may be invalidated, the TDL may not operate correctly, or it may be damaged. WARNING Isolate mains power before commencing installation. WARNING Make sure that power is disconnected or switched off before connecting any cable. US Version: The US version must be installed using a suitable cabling conduit system in accordance with local codes and regulations. To aid installation, the unit is supplied without an attached cable. The terminals are suitable for single wires/flexible leads 0.2 mm2 to 1.5 mm2 (AWG 16–24). WARNING The electrical installation must be performed in accordance with National Electrical Codes of practise and/or any other applicable national or local codes. WARNING Wait 2 minutes before opening the enclosure after de-energizing the system. 67 Laser Spectrometer GPro 500 WARNING When fitting the enclosure cover onto the sensor head, the 8 x M5 fixing screws must be tightened to 8 Nm torque. WARNING For gas group A, sealing of the conduit is required at the enclosure entry. For gas groups B, C and D, no conduit sealing is required. Power supply ot the GPro 500 and M400 The GPro 500 and the M400 have to be powered separately: –– GPro 500: 24 VDC, 5 W minimum –– M400 transmitter: 20–30 V DC or 100–240 V AC WARNING Always check the complete wiring between the M400 transmitter, the GPro 500 sensor head, junction box (if applicable) and external temperature and pressure sensors before switching on the sensor. WARNING Always check all the electrical and grounding connections before switching on the power. 5.1 Electrical Safety and Grounding The GPro 500 does not incorporate an integral on/off switch. You must provide a means of externally isolating the electrical supply from the GPro 500: use a suitable switch or circuit breaker located close to the GPro 500, clearly marked as the disconnecting device for the GPro 500. –– The electrical supply circuit must incorporate a suitable fuse or over-current protection device, set to or rated at no more than 10 A. –– The GPro 500 must be connected to an external protective earthing system via one of the screws for the lid to the sensor head (see Figure 32 on page no 70). –– Ensure that your electrical supply can provide the necessary maximum power consumption. Refer to "Product data" on page no 24. –– Equipment connected to the mA input, mA output, RS 485 and Ethernet must be separated from mains voltages by at least reinforced insulation. –– Ensure that the cables that you connect to the GPro 500 are routed so that they do not present a trip hazard. –– All signal and electrical supply cables must be rated for temperatures of 70 °C or higher. When you carry out insulation testing, disconnect all cables from the GPro 500. 68 Power supply ot the GPro 500 and M400 The GPro 500 and the M400 have to be powered separately: –– GPro 500: 24 VDC, 5 W minimum –– M400 transmitter: 20–30 V DC or 100–240 V AC WARNING Always check all the electrical and grounding connections before switching on the power. Instrument Protective Grounding WARNING It is important that the protective ground connection provided at the analyzer enclosure is connected to a suitable instrument grounding (earthing) point at the site of installation. The GPro 500 is supplied with both internal and external protective grounding (earth) connections. The external protective grounding connection is clearly labelled and consists of an M6 x12mm screw located on the flange of the instrument cover. The internal protective grounding connections are located inside the instrument enclosure and are used for connection of the cable outer screen. See drawing "Protective Grounding." on page no 70 for location of protective ground connections. ATEX Protective Grounding Note: The European ATEX certified version is supplied pre-wired with the internal grounding connection already terminated to the cable outer screen. IMPORTANT: The instrument cover MUST NOT be opened under any circumstances, as this will invalidate the safety certification. For the external protective grounding a suitable grounding cable should be appropriately terminated and attached to the M6 x12mm protective ground connection. The other end of the cable should be terminated at a suitable instrumentation grounding point at the installation site. FM Protective Grounding The FM certified version is supplied without an attached cable. When installing the multicore cable, the cable screen should be appropriately terminated at one of the two internal protective grounding points, using the supplied M4 x 6mm screw. For the external protective grounding a suitable grounding cable should be appropriately terminated and attached to the M6 x12mm protective ground connection. The other end of the cable should be terminated at a suitable instrumentation grounding point at the installation site. Grounding cable needs to be in accordance with the NEC regulations. 69 Laser Spectrometer GPro 500 External earth point for > 4 mm2 cables (M6 x 12) Figure 32 External earth point. Standard probe (SP) process adaptor shown. Protective grounding Material: chromated AISi7Mg0.3 Size: M6x12 mm 2 options for inner protective grounding Material: 1.4404 (AISI 316L) Size: M4x6 mm Hex cap screw Connect with 4 mm2 cable Figure 33 Protective Grounding. 70 5.2 Sensor head connections ATEX Version: In the ATEX Version, the sensor head is supplied with a pre-configured cable already installed. Do not open the sensor head for removing, altering, or replacing the cable. The junction box is the interface between the GPro 500 and the M400 and also the Ethernet. Any suitable junction box approved for the hazardous area can be used. The GPro 500 can be supplied with the optional accessory GHG 731.11 which is a suitable junction box supplied by Malux. The dimensions of this is shown below: WARNING Opening the sensor head voids the warranty and violates the ATEX certification. 1 2 3 2 4 5 6 7 3 8 4 9 10 11 12 13 14 15 16 5 6 1 7 Figure 34 Connections in the junction box 1 2 3 4 5 6 7 Connections to the GPro 500 – Cable numbers below. Power to the GPro 500 from an external 24 V, 5 W minimum source RS 485 from the M400 4...20 mA from temperature sensor 4...20 mA from pressure sensor Direct analog output (2x 4…20 mA) (optional) Ethernet 71 Laser Spectrometer GPro 500 Figure 35 Wiring diagram with active analog inputs. 72 Figure 36 W  iring diagram with loop-powered analog inputs. 73 Signal Description Cable no. Color Power + 24 V Power 24V, 5W 1 Red 2 Blue 3 Green 4 Yellow 5 Brown 6 Purple 7 Black 8 Pink 9 Grey GND (Power) RS 485 A Interface M400 (RS 485) RS 485 B RS 485 GND 4...20 mA pos Current input temperature 4...20 mA neg 4...20 mA pos Current input pressure 4...20 mA neg + 24 V 10 Red/Blue Out 1 11 Grey/Pink Out 2 12 White 13 White/Yellow TX– 14 Yellow/Brown RX+ 15 White/Green RX– 16 Brown/Green TX+ SIL direct anolog output (2x 4…20 mA) (optional) Ethernet interface for communication with PC 120 (4.72") 140 (5.51") Laser Spectrometer GPro 500 Table 5 GPro 500 cables 1 3 5 2 4 6 Figure 37 The junction box GHG 731.11 (EX-e) 1 2 3 4 5 6 74 Connection for the TDL Connection for external power supply Ethernet connection Connection for temperature sensor (4...20 mA) Connection for pressure sensor (4...20 mA) Connection for M400 (RS 485) The connection are done to the same number in the GPro 500 and in the junction box except for the Ethernet cable. This cable has to be equipped with an Ethernet connector in the GPro 500 side and screwed to the appropriate screw connectors in the junction box. The connection diagram is shown below. US Version: The US version must be installed using a suitable cabling conduit system in accordance with local codes and regulations. To aid installation, the unit is supplied without an attached cable. For suitable cables (for example Lapp UNITRONIC FD CP [TP] plus) please see Appendix 2, chapter 2.3 (Accessories) on page no 126. The terminals are suitable for single wires/flexible leads 0.2 mm2 to 1.5 mm2 (AWG 24–16). WARNING The electrical installation must be performed in accordance with National Electrical Codes of practise and/or any other applicable national or local codes 1 2 3 2 4 5 6 7 3 8 4 9 10 11 12 13 14 15 16 5 6 1 7 Figure 38 Connections in the junction box 1 2 3 4 5 6 7 Connections to the GPro 500 – Cable numbers below. Power to the GPro 500 from an external 24 V, 5 W minimum source RS 485 from the M400 4...20 mA from temperature sensor 4...20 mA from pressure sensor SIL2 direct analog output (2x 4…20 mA) (optional) Ethernet 75 Laser Spectrometer GPro 500 TB1 Pin 1 Pin 4 Figure 39 Connections on motherboard in the sensor head TB2 Pin 1 Pin 12 Figure 40 Connections on IO board in the sensor head 76 Table 6 GPro 500 cables Signal Description Cable no. Junction Box Color Power + 24 V Power 24 V, 5 W 1 Red 1 2 Blue 2 3 Green 3 4 Yellow 4 5 Brown 5 6 Purple 6 7 Black 7 8 Pink 8 9 Grey 9 10 Red/Blue 10 11 Grey/Pink 11 12 White 12 13 White/Yellow 1 14 Yellow/Brown 2 RX+ 15 White/Green 3 RX– 16 Brown/Green 4 GND (Power) RS 485 A Interface M400 (RS 485) RS 485 B RS 485 GND 4...20 mA pos Current input temperature 4...20 mA neg 4...20 mA pos Current input pressure 4...20 mA neg + 24 V Out 1 Direct anolog output (2x 4…20 mA) (optional) Out 2 TX+ TX– Ethernet interface for communication with PC TB1 Pin no TB2 Pin no For all versions. WARNING All openings have to be closed with certified cable glands or blocking plugs of the same degree of certification as the GPro 500. WARNING It is essential that you observe all provided information and warnings. The system must be closed and grounded before switching on the system. For version with optional direct analog outputs. WARNING Do not connect the M400 and the direct passive analog outputs at the same time. 77 Laser Spectrometer GPro 500 5.3 M400 connections WARNING AC Power for EX versions may only be connected via a suitably certified Purge Control Unit. The power cable is attached inside the M400. It shall be a two core cable with Line/Live (L), Neutral (N) conductors. The power cable connection terminals are suitable for solid or stranded conductors 0.205 to 2.5 mm2 (24 to 13 AWG). Connect your mains electrical supply cable as follows: 1 Pass your mains electrical supply cable through a suitable cable-gland fitted to the base of the power/interface compartment. 2 Connect the wires in the supply cable to the appropriate electrical supply terminals in the M400 as follows and as shown in Figure 41 (Cable connections in M400) on page no 78. Table 7 Mains power supply terminals Signal Terminal on mains power supply Live L Neutral N USB 1 3 - + N L POWER TB1 1 2 3 4 5 6 7 8 9 1011121314 4 1 2 3 4 5 6 7 8 9 123456789 TB2 TB3 123456789 TB4 2 Figure 41 Cable connections in M400 1 2 3 4 78 Connection terminal for the power cable TB4 – connection terminal for the GPro 500 TB1 – connection terminal for the relays. These can be configured with the M400. TB2 connection terminals for external 4–20mA outputs Table 8 RS 485 connection of GPro 500 to M400 terminal TB4 Pin no. Description 1 2 3 4 5 6 GND 7 RS 485B 8 RS 485A 9 Table 9 M400 terminal TB1 relay connections Pin no. Description 1 NO1 2 COM1 3 INC1 4 NO2 5 COM2 6 NC2 7 COM5 8 NC5 9 COM6 10 NC6 11 NO3 12 COM3 13 NO4 14 COM4 Table 10 M400 4 – 20mA Output connections Pin no. Description 1 AO1+ 2 AO1–/AO2– 3 AO2+ 4 AO3+ 5 AO3–/AO4– 6 AO4+ 7 DI1+ 8 DI1–/DI2– 9 DI2+ 79 6 Service Laser Spectrometer GPro 500 6.1 Connecting a PC The MT-TDL software is the GPro 500 service tool. With this software all parameters can be access and all possible settings can be modified. To run it you need to connect a PC, with the software installed, to the Ethernet port in the junction box as illustrated below. P T 1 Figure 42 Connecting a PC. Standard probe (SP) process adaptor shown 1 Ethernet connection When accessing the MT-TDL with a PC it is important to make sure that no work is performed at the same time via the M400. WARNING When accessing the GPro 500 using the MT-TDL software, work using the laptop or PC must comply with the restrictions in place for working in hazardous areas. 80 6.2 Setting up your PC to connect to the GPro 500 using the MT-TDL Software This instruction applies to Windows XP users only. If you are using Windows 7 your system will automatically use the correct IP address. Open the Control Panel and double click Network Connections Figure 43 Network connections Double click Local Area Connection Figure 44 Local area connections Choose Internet Protocol (TCP/IP) and then Properties 81 Laser Spectrometer GPro 500 Figure 45 Local area connection properties Select Use the following address and type in an IP number of the same series as the IP number of your GPro 500 unit (this number is given on the calibration certificate). If your GPro 500 has IP number 192.168.2.16 the computer IP address can be set to 192.168.2.1. If not already set choose Subnet [255.255.0.0] 82 Figure 46 Internet protocol (TCP/IP) properties Close all windows and start up the MT-TDL software. It is recommended to use an Ethernet hub between the PC or laptop and the TDL head. If port conflicts occur, disable manually all local connections and start the MT-TDL software. 83 Laser Spectrometer GPro 500 6.3 The MT-TDL software The most important function of the MT-TDL software from a service standpoint is the log capabilities. When connected to the GPro 500 with your PC it is possible to start a log of selected parameters for a defined period of time. One can then disconnect the PC from GPro 500 and with the log data stored on the SD-card it can easily be access at a later time. A log folder is created on the SD-card and the files within this folder can either be sent to trained staff at Mettler Toledo for further investigation or it can be viewed locally on your PC with the MT TDL log viewer. Files are stored in date stamped folders, one folder for each day. The software has three access levels but the normal user will only use the first one (Normal). The remaining two access levels are restricted for use by METTLER TOLEDO personnel. You can perform the following tasks under the Normal access level: 1 2 3 4 5 Concentration trend – Here you can follow the concentration value in the lower plot. Transmission trend – Here you can follow the optical transmission value in the lower plot. Data logging Ext sensor Analog output (Note: only available if connected to a TDL with this option) Through different menus the necessary installation parameters may be set. After setting the necessary parameters the PC is no longer needed. The GPro 500 has all the parameters stored in the internal memory. The PC can therefore be disconnected and the GPro 500 can be turned off and on without resetting the parameters. Once the program starts the user is presented with a screen like the one in the illustration below. It consists of an upper part and a lower part. In the upper screen a plot of the signal processed absorption lines and the model absorption lines are shown. The version of the service program is also shown to the right (in the example here) as is also the IP number of the GPro 500. The content in the lower part is specific to the function the user chooses – concentration trend, trans­ mission trend, etc. The following paragraphs will discuss their content. 84 6.3.1 The ppm trend In this screen the user can monitor the measured concentration value over time: The present values of concentration, transmission, temperature and pressure in the process are shown to the right. 4 3 5 6 7 8 9 1 2 10 11 12 13 14 15 Figure 47 The ppm trend Here follows a descriptions of some of the settings for this screen. Note that settings 3 through 16 are visible on all the different screens. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Scan no Unit for the concentration Version of the software IP number of the GPro 500 The fixed value for the temperature The fixed value for the pressure Toggle between fixed and measured values for temperature and pressure The effective path length Setpoint for calibration Actual O2 concentration Actual transmission External temperature reading External pressure reading Alarm Reset all trends 85 6.3.2 The transmission trend Laser Spectrometer GPro 500 In this screen the user can monitor the optical transmission level in the measurement path over time: The present values of concentration, transmission, temperature and pressure in the process are shown to the right. 86 Figure 48 The transmission trend 6.3.3 Data logging This screen is used to administer the data logging capabilities of the software. Figure 49 Data logging By changing the “SPC Interval(s)” to 1 sec. or more the log will start. By setting the log interval to 1 sec. the system will store a log record every one second. Each log record is 8 kb, the total space available is 80% of 4GB (3.2GB). When the available space is used up the system will automatically replace the oldest log record. By changing the “SPC Interval(s)” back to 0 sec. the log will stop. By pushing the button “Get Files” you will download the entire log file to your PC. The log can later be viewed/analyzed by using the MT-TDL Viewer. 87 6.3.4 External sensors Laser Spectrometer GPro 500 When using external inputs for Temperature and Pressure, the inputs have to be configured according to the customer specifications. This is done in this screen. 88 Figure 50 External sensors 6.3.5 Diagnostic On this tab, several ISM related data is available. ISM (Intelligent Sensor Management) is ­METTLER ­TOLEDO’s concept for proactive, real-time sensor health monitoring. The ISM relevant data for the GPro 500 contain the following: –– DLI (Dynamic Lifetime Indicator): The DLI indicates in days the expected laser diode remaining lifetime, based on current usage. This value is read-only and is a general indication of the analyzer’s recommended duration until complete replacement. When the DLI reaches zero, the analyzer will continue to measure but the alarm will appear in the M400 transmitter. –– TTM (Time to Maintenance): The TTM is evaluating in real-time the remaining time until the minimum recommended transmission value of 10% is reached. This evaluation is based on the current rate of transmission loss under the present process conditions. When the TTM reached zero, cleaning of the optics or even replacement of optics parts is recommended. –– T-max extern: this is the maximum temperature at which the GPro 500 process adaption has been exposed to from the process gas stream. –– Operating hours: the service time of the GPro 500 in hours. –– Create Diagnostic file: use this button for troubleshooting the unit. When the butten “Create diagnostic file” is pressed, a ZIP compressed file is created after 15 seconds on the desktop. The ZIP file contains: –– the log file (equivalent to clicking on the “Get logfile” button). –– 10 spc files containing the full spectral data of the last 10 seconds in service. –– the ppm trend values –– the % trend values –– the calibration history file The data ZIP file cannot be opened by the user. Please send the ZIP file to your METTLER TOLEDO representative for further analysis.. Figure 51 Diagnostic 89 6.3.6 Calibration data Laser Spectrometer GPro 500 The calibration tab shows a summary of all successfully executed calibrations on the unit. 90 Figure 52 Calibration 6.3.7 Analog Outputs (optional) When an Ethernet connection is established to a GPro 500 with the option Direct Analog Outputs, the tab ”external out” appears. This screen is used to configure the 4…20 mA passive analog outputs (for correct wiring please refer to chapter 5 (Electrical Connections) on page no 67). Please note that there is no configuration menu in the M400 in order to set up the direct analog outputs. Figure 53 Analog outputs (optional) For each channel to be used, select the parameter to be mapped to the channel using the pull down menu. The following measured values can be mapped on each channel: –– –– –– –– –– –– –– Concentration (ppm) Concentration (%v) Pressure (mbar and psi) Temperature (°C and °F) Transmission (%) DLI (days) TTM (days) When the parameter is selected, key in the range that has to be linearly mapped to the 4…20 mA values. Units must be the same as those of the parameter selector above. 91 Laser Spectrometer GPro 500 WARNING For SIL2 installations the direct analog output version must be used and only these outputs should be connected to external systems. An M400 transmitter can be added if desired, but note that the M400 is not SIL certified and its 4-20mA outputs MUST NOT be used. Figure 54 Selecting a parameter To assign the high-level error signals to each channel (hardware, software and system) to be relayed to the control system, use the corresponding pull-down menu, see picture below. The following choices can be selected: –– N o alarm: when the error occurs, no action is taken to set the analog outputs in alarm condition. –– Alarm condition low (3.6 mA) –– Alarm condition high (22 mA) Additionally, when the analog outputs can be set to the 3.8 mA or 21 mA state when an out-ofrange condition has to be detected by the system. To do this, check the corresponding box (underrun/overflow). Figure 55 Selecting alarms Hold mode: during operations such as calibration as well as when in alarm state, the reading when in hold mode can be set to the following values: –– Last value –– Fixed value 92 The fixed readings for the gas concentration, temperature, pressure and % transmission can be set using the corresponding fields. Figure 56 Selecting hold mode 6.4 The Viewer The viewer is a diagnostic tool that enables you to view data that was earlier logged by the MT-TDL software and stored on the SIM card in GPro 500. Figure 57 The viewer With the MT-TDL Viewer log files that has been downloaded and stored on your PC can be viewed/ analyzed. 93 7 Operation, Maintenance and Calibration Laser Spectrometer GPro 500 7.1 M400 Key features of the M400 are the Integration of ISM functionality and the unique mixed-mode input feature (accepting conventional or ISM sensors). Figure 58 M400 front 1 8 languages – English – Spanish – French – German – Italian – Portuguese – Russian – Japanese 2 Large backlit display (4 text lines) 3 Password protection (5 digit, numeric) 4 Multi parameter unit 5 ISM (the availability of specific ISM functions is dependent of the measured parameter) – Plug and Measure – Dynamic Lifetime Indicator (DLI) – Adaptive Calibration Timer (ACT) – Time to Maintenance Indicator (TTM) – CIP/SIP/Autoclaving counter – Calibration history 6 FM Cl1 Div 2, Atex Zone 2, IP 65 /NEMA 4X protection 7 Quick Setup Mode 94 7.1.1 Instrument Start-up Assuming that the TDL is connected to the M400 Transmitter, the TDL will power-up automatically when power is switched on to the M400. The start-up time is approximately 1 min. 7.1.2 Instrument Shut-down To shut down the instrument simply disconnect it. No other measures needs to be taken. 95 7.2 Verification and Maintenance Laser Spectrometer GPro 500 One-point calibration for TDL gas sensors Enter calibration mode as described in section 7.1 “Enter Calibration Mode”. B 20.9 %V O B 25.0 °C A one-point calibration of gas sensors is always a slope (i.e. with air) calibration. A Calibrate Sensor u Channel B TDL one point slope calibration is done in air or any other calibration gas with defined gas concentration. 2 B Select 1 point as calibration type. 20.9 %V O 25.0 °C 2 H TDL Calibration Type = 1 Point Press [ENTER]. u Enter values for the effective temperature and pressure values of the gas used for B 20.9 %V O calibration. When using the calibration tube for calibration, use values measured 25.0 °C Pressure = 1013 hPa manually for the gas present in the calibration tube. Temperature = 23.00 °C u 2 Adjust the optical path length for your individual system. Place the sensor in the calibration gas (e.g. air). Press [ENTER]. B 20.9 %V O 25.0 °C Depending on the used drift control (see chapter 8.2.3.5) one of the two following Press ENTER when u Sensor is in Gas modes is active. 2 Process calibration for TDL gas sensors Enter calibration mode as described in section 7.1 “Enter Calibration Mode”. B 12.1 %V O B 25.0 °C A process calibration of gas sensors is always a slope calibration. Calibrate Sensor 2 u Channel B Oxygen Select Process as the calibration type. B 12.1 %V O 25.0 °C Press [ENTER] TDL Calibration 2 u Type = Process Take a sample and press the [ENTER] key again to store the current measuring value. B 12.1 %V O To show the ongoing calibration process, A or B (depending on the channel) is blinkB 25.0 °C Press ENTER to Capture ing in the display. u B O =0.0000 V% O 2 2 2 After determining the concentration value of the sample press the c key again to proceed with the calibration. Enter the concentration value of the sample then press the [ENTER] key to start the B 12.1 %V O calculation of the calibration results. B 25.0 °C 2 B Point1 = 56.90 %sat B O2 = 57.1 %air u After the calibration the slope ”S” is displayed. B 12.1 %V O B 25.0 °C In case of a successful calibration, the calibration values are stored in the cal history O S=– 0.070 nA Z=0.0000 nA u Save Adjust and taken over (Adjust), stored in the cal history and not taken over (Calibrate) or discarded (Abort). 2 2 If ”Adjust” or ”Calibrate” are chosen, the message ”Calibration successful” is displayed. The M400 returns to the measuring mode. Calibration using a calibration cell (for O2 measurements only) For a more accurate calibration the calibration cell can be used. Doing this the TDL 96 (the units head) needs to be removed from the probe. Then it has to be mounted on the calibration cell according to the illustration below. Before calibration is started new values for path length, temperature and pressure have to be entered on M400. Then the calibration gas is flowed through the calibration cell and the calibration is done in the calibration menu of M400. During calibration with the calibration cell the process is still sealed and no extra precautions need to be taken. EPL 2x100 (3.94”) 104,6 (4.12”) 150 (5.91”) Figure 59 Calibration cell 7.3 Maintenance The GPro 500 TDL is designed to reduce maintenance to a minimum. Experience has shown that maintenance interval of more than 3 months is acceptable for most applications. The maintenance operations described in this section will secure a continuous and safe operation of the monitor. 7.3.1 Routine maintenance GPro 500 has no moving parts and require no consumables. TTM and DLI in M400 can generate maintenance requests - for instance if the transmission drops. For best performance, however, we recommend to routinely carry out the following steps: –– Check optical transmission regularly (daily). This can be done automatically by TTM and DLI or WARNING relay or similar. –– Clean windows when necessary (see below). –– For applications where the concentration of the measured gas is normally zero (zero gas application): Check instrument response by applying some gas at least once every 12 months. Apply sufficiently high gas concentrations to obtain a strong instrument response for at least 10 minutes (at least 70 minutes after power on). No warnings or errors should be displayed during the test. Contact your supplier if you are in doubt about your instrument. –– Check calibration every 12 months (depending on the required accuracy). Recalibrate if necessary, see "Calibration" on page no 100. 7.3.2 Remove the probe or wafer cell from the process The GPro 500 is removed from the process by loosening the four bolts on the flange and carefully extracting it. If necessary the purging connection may have to be removed as well. For wafer cell removal, the process must first be stopped, or the pipe section isolated via closure of isolation valves. The flange mounting bolts can then loosened and removed and the wafer cell carefully extracted from the pipe flanges. 97 Laser Spectrometer GPro 500 WARNING Before removing the probe or wafer cell from the process it is very important to verify with the plant manager that it is safe. The process must be shut down or in a state so it is safe to expose the ambient environment to it. WARNING Do not turn off the purging before removing the probe. This will prevent the optical surfaces from being contaminated 7.3.3 Removing & cleaning the corner cube To remove the corner cube you need to unscrew the end cap on the probe. Thereafter the unit containing the corner cube can be taken out. Carefully clean the surface of the corner cube and remount it. The optical surface can be cleaned with non-hazardous, non-abrasive detergents or solvents. Iso-propyl alcohol (IPA) is the recommended solvent for optical component cleaning. 1 2 Figure 60 Cleaning/Replacing the corner cube on standard probe (SP) and non-purged probe (NP). 1 Corner cube module 2 Probe end cap As the in-line wafer cells is integral of the process and in order to maintain the integrity of the PED (Pressure Equipment Directive) certification, the corner cube should not be removed. 7.3.4 Cleaning the probe process window To clean the process window you need to remove the probe from the process, see 7.3.2 on page no 97. Remove the sensor head, unscrew the probe and then unscrew the purging tube with holder. Carefully clean the surface of the process window. The optical surface can be cleaned with non-hazardous, non-abrasive detergents or solvents. Iso-propyl alcohol (IPA) is the recommended solvent for optical component cleaning. WARNING Do not remove the process window from the window module since that will void the pressure certificate. 98   The process side purge connection is fitted with a seal between the fitting and the purge h­ ousing to conform to the pressurized equipment directive (PED). To ensure the integrity of this seal and to prevent damage when connecting the purge tube to the fitting, a back spanner (wrench) must be used to securely hold the fitting body as the purge pipe nut is tightened, as illustrated in Figure 61 below. Figure 61 Connecting purge pipe to process side purge fitting. WARNING Do not remove and / or disassemble the purge gas inlet for process (7). If disassembled, the PED pressure certificate is void. 1 2 3 7 6 4 5 Figure 62 Cleaning the probe process window. 1 2 3 4 5 6 7 Sensor head Process window Window module Purging tube with holder Probe Flange Purge gas inlet fitting process side 99 Laser Spectrometer GPro 500 WARNING The high pressure glass in the probe must not be subject to any mechanical impact which might cause damage to the glass (scratch, gash etc.). When cleaning the glass it must be done with a soft cloth. Make sure that it is safe to dismount the probe before cleaning. If the process window cannot be cleaned correctly, the whole window module and flange assembly need to be replaced. WARNING The window module 3 is securely attached to the flange 6 using hex head screws. Do not attempt to remove or untighten the screws, as this will void the PED pressure certificate. WARNING When reassembling the probe 5, carefully slide the purging tube 4 inside and screw the probe into the flange 6 until the thread is fully seated. This is to ensure the tightness of the purging system inside the probe. 7.4 Calibration If the GPro 500 is installed together with the M400 transmitter, then the M400 can be used to perform calibration/verification directly. See section 7.1 for details or refer directly to the M400 manual for further information. 7.4.1 Process Calibration Calibration directly in the process can be done if the concentration of the gas to be measured is known and stable. This is very convenient and is done very quickly from the calibration menu on M400. For details, see the M400 manual on page 67. 7.4.2 Calibration using calibration cells (O2 only) For O2 analyzers, the optional calibration cell can be used to provide a quick and accurate calibration/validation check. Doing this the TDL (the units head) needs to be removed from the probe. Then it has to be mounted on the calibration cell according to the illustration below. Before calibration is started new values for path length, temperature and pressure have to be entered on M400. Then the calibration gas is flowed through the calibration cell and the calibration is done in the calibration menu of M400. During calibration with the calibration cell the process is still sealed and no extra precautions need to be taken. 100 EPL 2x100 (3.94”) 104,6 (4.12”) 150 (5.91”) Figure 63 Calibration cell 7.5 Residual Hazards Despite all precautionary measures taken, residual hazards still remain. 7.5.1 Leaky connections –– Connections can become loosened through the effects of vibration. –– The connection between measurement probe and process adaptor is a potential source of leakage. The connections between the measurement probe and the process adaptor must be checked regularly by the user/operator, and kept in full working condition. WARNING Leaky connections can allow process medium to escape to the environment, presenting a hazard for persons and the environment. 7.5.2 Electricity failure WARNING In case of electricity failure (releasing of the fuse) make sure that the mains power is properly disconnected before starting any trouble shouting. 7.5.3 Heat protection WARNING The housing is not equipped with heat protection. During operation the surface of the housing can reach high temperatures and cause burns. 7.5.4 External influences Objects falling on the housing can damage or destroy the TDL head, or cause leaks etc. Lateral forces may damage or destroy the TDL head. 101 8 Explosion Protection Laser Spectrometer GPro 500 8.1 ATEX Zone 1 Zone 0 8 P 2 T II 1/2G - Ex op is /[op is T6 Ga] d IIC T6 Ga/Gb II 1/2D - Ex op is /[op is T86°C Da] tb IIIC T86°C Da/Db 5 4 3 1 DN50 / ANSI 2" Zone 2 6 7 Figure 64 Ex setup 1 2 3 4 5 6 7 8 102 GPro 500 2 x 4...20 mA (pressure and temperature) Junction Box (Ex-e) Ethernet External power supply Purge box for Zone 1 (optional) M 400 For detailed cross section view – see Figure 65 (The GPro 500 Interface between Zone 0 and Zone 1) on page no 103 1 2 3 4 5 Figure 65 The GPro 500 Interface between Zone 0 and Zone 1 1 2 3 4 5 Zone 1 region Process window Check valve Zone 0 region Interface sensor head – probe The process window and the check valve make sure that Zone 0 and Zone 1 are physically separated. The sensor head is always in Zone 1 and the probe is in Zone 0. CAUTION For intended installation in an Ex classified area, please observe the following guidelines (ATEX 94/9/EC). Ex classification: Ex II 1/2G - Ex op is/[op is T6 Ga] d IIC T6 Ga/Gb and Ex II 1/2D - Ex op is/[op is T86°C Da] tb IIIC T80°C Da/Db Designation and number of the declaration: SEV 12 ATEX 0114 WARNING In the normal configuration, the temperature at the interface 5 between the sensor head and the probe may not exceed 55 °C. If the temperature exceeds 55 °C at the interface to the sensor head temperature class T6 (85 °C) is no longer valid and the ATEX classification is violated. WARNING If the temperature at the interface 5 between the sensor head and the probe exceeds 55 °C, the Thermal Barrier – see chapter 2.3 (Accessories) on page no 126 – has to be used in a way that the temperature at the interface to the sensor head never exceeds 55 °C. If the temperature exceeds 55 °C at the interface to the sensor head temperature class T6 (85 °C) is no longer valid and the ATEX classification is violated. 103 WARNING Laser Spectrometer GPro 500 The metallic enclosure of the TDL sensor has to be connected by conductive wiring with the grounding system of the plant.                        Figure 66 Label. 1 2 3 4 5 6 7 8 9 10 11 12 Gas to be measured: Oxygen (O2), Carbon monoxide (CO) or Water vapour (H2O) Manufacturer Country of origin Product name Product key Part no. Serial no. Ambient temperature limits ATEX markings Power rating Enclosure ratings SIL Mark 1/2" NPT WARNING DO NOT OPEN THE DEVICE Figure 67 Note label. For further guidelines for ATEX compliance please also consult the following chapters of these operating instructions: –– see chapter 3 (Installation and Start-up) on page no 34 –– see chapter 5 (Electrical Connections) on page no 67 –– see chapter 7 (Operation, Maintenance and Calibration) on page no 94 M6x12 Figure 68 Grounding label. 104 Figure 69 ATEX Cerfificate (page 1/2). 105 Laser Spectrometer GPro 500 Figure 70 ATEX Cerfificate (page 2/2) 106 EU Declaration of Conformity / EU-Konformitätserklärung / Déclaration de conformité Declaración de conformidad UE / Certificazione di conformità UE / ЕС européenne / EU Prohlášení o shodě / EU-overensstemmelseserklæring декларация за съответствие / / Δήλωση συμμόρφωσης Ε.Ε. / ELi vastavusdeklaratsioon / EUDearbhú Comhréireachta AE / EU izjava o sukladnosti / vaatimustenmukaisuusvakuutus / EU Megfelelőségi nyilatkozat / EU適合宣言 / EU 적합성 선언 / ES atitikties deklaracija / ES atbilstības deklarācija / Dikjarazzjoni ta’ Konformità tal-UE / EUDeklaracja zgodności UE / Declaração de Conformidade da UE / conformiteitsverklaring / Declaraţie de conformitate UE / Декларация о соответствии требованиям ЕС / EÚ Izjava o skladnosti EU / EU-försäkran om överensstämmelse / Vyhlásenie o zhode / เอกสารแสดงการปฏิบต ั ิตามมาตรฐานสหภาพยุโรป (Declaration of Conformity) Product / Produkt / Produit / Producto / Prodotto / Продукт / Výrobek / Produkt / Προϊόν / Toode / Tuote / Táirge / Proizvod / Termék / 製品名 / 제품 / Gaminys / Izstrādājums / Prodott / Product / Produkt / Produto / Produs / Продукция / Produkt / Izdelek / Produkt / ถังเก็บ / 产品 Manufacturer / Hersteller / Fabricant / Fabricante / Produttore / Производител / Výrobce / Producent / Κατασκευαστής / Tootja / Valmistaja / Déantúsóir / Proizvođač / Gyártó / メーカー / 제조업체 / Gamintojas / Ražotājs / Manifattur / Producent / Producent / Fabricante / Producător / Производитель / Výrobca / Proizvajalec / Tillverkare / ผู้ผลิต / 制造商 / EU 一致性声明 GPro 500 Mettler-Toledo GmbH Im Hackacker 15 8902 Urdorf, Switzerland This declaration of conformity is issued under the sole responsibility of the manufacturer. / Die alleinige Verantwortung für die Ausstellung dieser Konformitätserklärung trägt der Hersteller. / La présente déclaration de conformité est établie sous la seule responsabilité du fabricant. / La presente declaración de conformidad se expide bajo la exclusiva responsabilidad del fabricante. / La presente certificazione di conformità è rilasciata sotto la responsabilità esclusiva del produttore. / Настоящата декларация за съответствие е издадена под единствената отговорност на производителя. / Toto prohlášení o shodě vydává výrobce na svou vlastní odpovědnost. / Producenten er eneansvarlig for udstedelsen af denne overensstemmelseserklæring. / Η παρούσα δήλωση συμμόρφωσης εκδίδεται με αποκλειστική ευθύνη του κατασκευαστή. / See vastavusdeklaratsioon on väljastatud tootja ainuvastutusel. / Vaatimustenmukaisuusvakuutus on annettu valmistajan yksinomaisella vastuulla. / Is faoi fhreagracht an déantúsóra amháin a eisítear an dearbhú comhréireachta seo. / Ova izjava o sukladnosti izdaje se pod punom odgovornošću proizvođača. / Az alábbi megfelelőségi nyilatkozat kiadásáért kizárólag a gyártó felelős. / この適合宣言書はメーカーの単独責任において発行されます。 / 이 적합성 선언은 제조업체의 단독 책임하에 발행되었습니다. / Ši atitikties deklaracija išduota tik gamintojo atsakomybe. / Šī atbilstības deklarācija ir izdota vienīgi uz ražotāja atbildību. / Din id-dikjarazzjoni ta’ konformità hi maħruġa taħt ir-responsabbiltà unika talmanifattur. / Deze conformiteitsverklaring wordt verstrekt onder de exclusieve verantwoordelijkheid van de producent. / Ta deklaracja zgodności została wystawiona na wyłączną odpowiedzialność producenta. / Esta declaração de conformidade é emitida sob a responsabilidade exclusiva do fabricante. / Prezenta declaraţie de conformitate este emisă pe răspunderea exclusivă a producătorului. / Настоящая декларация о соответствии выпущена под исключительную ответственность производителя. / Toto vyhlásenie o zhode vydáva výrobca na vlastnú zodpovednosť. / Za izdajo te izjave o skladnosti je odgovoren izključno proizvajalec. / Denna försäkran om överensstämmelse utfärdas på tillverkarens eget ansvar. / เอกสารแสดงการปฏิบต ั ต ิ ามมาตรฐานนีอ ้ อกให้ภายใต้การรับผิดชอบแต่เพียงผูเ้ ดียวของผู้ผลิต / 本一致性声明基于制造商独立承担责任的原则。 The object of the declaration described above is in conformity with the following European directives and standards or normative documents: / Der oben beschriebene Gegenstand der Erklärung erfüllt die Vorschriften der folgenden europäischen Richtlinien und Normen oder normativen Dokumente: / L'objet de la déclaration décrit ci-dessus est en conformité avec les directives et normes européennes suivantes et autres documents à vocation normative : / El objeto de la declaración descrita anteriormente se ajusta a lo establecido en las siguientes directivas, normas y documentos normativos europeos: / L'oggetto della dichiarazione di cui sopra è conforme a direttive, norme o standard europei di seguito: / Предметът на декларацията, описан по-горе, е в съответствие със следните европейски директиви и стандарти или нормативни документи: / Výše popsaný předmět prohlášení je v souladu s následujícími evropskými směrnicemi a normami nebo normativními dokumenty: / Genstanden for erklæringen, som beskrevet ovenfor, er i overensstemmelse med følgende europæiske direktiver og standarder eller normative dokumenter: / Το αντικείμενο της δήλωσης που περιγράφεται παραπάνω συμμορφώνεται με τις παρακάτω ευρωπαϊκές οδηγίες και πρότυπα ή κανονιστικά έγγραφα: / Ülalkirjeldatud deklareeritav toode on kooskõlas järgmiste Euroopa direktiivide ja standardite või normdokumentidega: / Yllä määritetyn vakuutuksen tavoite noudattaa seuraavien eurooppalaisten direktiivien, normien tai normatiivisten asiakirjojen vaatimuksia: / Tá cuspóir an dearbhaithe a dtugtar cur-síos air thuas de réir na dtreoracha agus na gcaighdeán Eorpach nó de réir na ndoiciméad normatach Eorpach seo a leanas: / Predmet izjave naveden iznad u skladu je sa sljedećim europskim direktivama i normama normativnih dokumenata: / A fent említett nyilatkozat tárgya megfelel az alábbi európai irányelveknek, szabványoknak, illetve normatív dokumentumoknak: /上述の宣言書の目的は、機器が以下の欧州指令および規格あるいは規定文書に適合していることを宣言することです / 위에서 설명한 이 선언의 목적은 다음의 유럽 지침 및 표준 또는 규범 문서를 준수하는 데 있습니다. / Pirmiau aprašytas deklaracijos objektas atitinka šias Europos direktyvas ir standartus ar norminius dokumentus: / Iepriekš aprakstītais deklarācijas priekšmets atbilst tālāk norādītajām Eiropas direktīvām un standartiem vai normatīvajiem dokumentiem: / L-oġġett tad-dikjarazzjoni deskritta hawn fuq hu konformi mad-direttivi Ewropej u l-istandards jew id-dokumenti normattivi li ġejjin: / Het voorwerp van voornoemde verklaring is in overeenstemming met de volgende Europese richtlijnen en normen of normatieve documenten: / Treść powyższej deklaracji jest zgodna z następującymi dyrektywami europejskimi oraz normami lub dokumentami normalizującymi: / O objeto da declaração acima mencionada está em conformidade com as seguintes diretrizes e normas europeias ou documentos normativos: / Obiectul declaraţiei descris mai sus este în conformitate cu următoarele directive şi standarde europene sau acte normative: / Предмет декларации, описанный выше, соответствует следующим европейским директивам и стандартам или нормативным документам: / Predmet vyššie uvedeného vyhlásenia o zhode je v súlade s nasledujúcimi európskymi smernicami a normami alebo normatívnymi dokumentmi: / redmet zgoraj opisane izjave je skladen z naslednjimi evropskimi direktivami in standardi ali normativnimi dokumenti: / Föremålet för försäkran som beskrivs ovan överensstämmer med följande europeiska direktiv och standarder eller harmoniserade dokument: / ่ ธิบายไว้ขา้ งต้นสอดคล้องกับข้อกาหนดและมาตรฐานหรือเอกสารกฎระเบียบของสหภาพยุโรปดังต่อไปนี:้ / วัตถุประสงค์ของเอกสารตามทีอ 上述声明的目标与下面的欧洲指令、标准或规范性文件相符: 30328910_DoC GPro 500.doc Doc 30328910, Rev A, 02,2016 Figure 71 EC Declaration of conformity (page 1/2) 107 Laser Spectrometer GPro 500 Marking / Kennzeichnung / Marquage / Marcado / Marcatura / Маркировка / Označení / Mærkning / Σήμανση / Märgistus / Merkintä / Comharthú / Oznaka / Jelölés / EU Directive / EU-Richtlinie / Directive européenne / Directiva UE / Direttiva UE / Директива на ЕС / Směrnice EU / EU-direktiv / Οδηγία Ε.Ε. / ELi direktiiv / EU-direktiivi / Treoir AE / EU direktiva / EU-irányelv / 欧州指令 / EU 지침 / ES direktyva / ES direktīva / Direttiva tal-UE / EU-richtlijn / Dyrektywa UE / Diretiva da UE / Directiva UE / Директива ЕС / Smernica EÚ / Direktiva EU / EU-direktiv / ข้อกาหนดของสหภาพยุโรป / EU 指令 マーキング / 마킹 / Ženklinimas / Marķējums / Immarkar / Markering / Oznaczenie / Marcação / Marcaj / Маркировка / Označenie / Označevanje / Märkning / การทาเครือ ่ งหมาย / 标记 Harmonised Standards / Harmonisierte Normen / Normes harmonisées / Normas armonizadas / Standard armonizzati / Хармонизирани стандарти / Harmonizované normy / Harmoniserede standarder / Εναρμονισμένα πρότυπα / Ühtlustatud standardid / Yhdenmukaistetut standardit / Caighdeáin Chomhchuibhithe / Usklađene norme / Harmonizált szabványok / 整合化された規格 / 조화된 표준 / Darnieji standartai / Saskaņotie standarti / Standards Armonizzati / Geharmoniseerde normen / Normy zharmonizowane / Normas Harmonizadas / Standarde armonizate / Гармонизированные стандарты / Harmonizované normy / Harmonizirani standardi / Harmoniserade standarder / ่ อดคล้องกัน / 调和标准 มาตรฐานทีส Pressurised Equipment Directive / Druckgeräterichtlinie / Directive Équipements sous pression / Directiva sobre equipos a presión / Direttiva sulle attrezzature a pressione / Директива за оборудване под налягане / Směrnice pro tlaková zařízení / Direktiv om trykbærende udstyr / Οδηγία εξοπλισμού υπό πίεση / Rõhuseadmete direktiiv / Painelaitetta koskeva direktiivi / An Treoir maidir le Brú-Threalamh / Direktiva o opremi pod tlakom / Nyomás alatt lévő berendezésekről szóló irányelv / 圧力機器指令 / 가압 장비 지침 / Direktyva dėl slėginės įrangos / Spiedieniekārtu direktīva / Direttiva dwar Tagħmir Pressurizzat / Richtlijn drukapparatuur / Dyrektywa w sprawie urządzeń ciśnieniowych / Diretiva dos Equipamentos sob Pressão / Directiva privind echipamentele sub presiune / Директива по оборудованию, работающему под давлением / Smernica o tlakových zariadeniach / Direktiva o tlačni opremi / Tryckkärlsdirektivet / ี ารอัดแรงดัน / 加压设备指令 ข้อกาหนดของอุปกรณ์ที่มก EN12266-1: 2012 Effective from July-19-2016: 2014/68/EU (OJEU, 2014, L189, p164) Module A1 EMC Directive / EMV-Richtlinie / Directive CEM / Directiva CEM / Direttiva EMC / Директива за електромагнитна съвместимост / Směrnice EMC / EMC-direktivet / Οδηγία ΗΜΣ / Elektromagnetilise ühilduvuse (EMC) direktiiv / EMC-direktiivi / An Treoir maidir le Comhoiriúnacht Leictreamaighnéadach / Direktiva o elektromagnetskoj kompatibilnosti / Elektromágneses összeférhetőségről (EMC) szóló irányelv / EMC指令 / EMC 지침 / Direktyva dėl elektromagnetinio suderinamumo / EMS direktīva / Direttiva dwar EMC / EMC-richtlijn / Dyrektywa EMC / Diretiva CEM / Directiva CEM / Директива по электромагнитной совместимости / Smernica o elektromagnetickej kompatibilite (EMC) / Direktiva EMC / EMCdirektivet / ข้อกำหนด EMC / EMC 指令 EN 55011:2009+A1:2010 EN61326-1: 2013 EN61326-2-3: 2013 2014/30/EU (OJEU, 2014, L96, P79) 1 1258 ATEX Directive / ATEX-Richtlinie / Directive ATEX / Directiva ATEX / Direttiva ATEX / ATEX Директива / Směrnice ATEX / ATEX-direktivet / Οδηγία ATEX / ATEX-direktiiv / ATEXdirektiivi / An Treoir ATEX / ATEX direktiva / ATEX-irányelv / ATEX指令 / ATEX 지침 / Direktyva dėl sprogioje aplinkoje naudojamos įrangos / Sprādzienbīstamas vides (ATEX) direktīva / Direttiva dwar ATEX / ATEX-richtlijn / Dyrektywa ATEX / Diretiva ATEX / Directiva ATEX / Директива ATEX / Smernica ATEX / Direktiva ATEX / ATEX-direktivet / ข้อกาหนด ATEX / ATEX 指令 EN60079-0: 2012 + A11:2013 EN60079-1: 2014 EN60079-28: 2015 EN60079-31: 2014 2014/34/EU (OJEU, 2014, L96, p309) 1 Number of the Notified Body / Nummer der notifizierten Stelle / Numéro d'identification de l'organisme notifié / Número del organismo notificado / Numero dell'organismo notificato / Номер на нотифициран орган / Číslo notifikovaného orgánu / Nummer for det bemyndigede organ / Αριθμός του κοινοποιημένου οργανισμού / Teavitatud asutuse number / Ilmoitetun laitoksen numero / Uimhir an Chomhlachta dar Tugadh Fógra / Broj ovlaštenog tijela / A bejelentett szervezet száma / 公認機関の番号 / 공인 기관의 수 / Notifikuotosios įstaigos numeris / Pilnvarotās iestādes identifikācijas numurs / Numru tal-Korp Notifikat / Nummer van de aangemelde instantie / Numer jednostki notyfikowanej / Número do Organismo Notificado / Numărul organismului notificat / Номер уполномоченного органа / Číslo ั แจ้ง / 认证机构编号 / notifikovaného orgánu / Številka obveščenega telesa / Nummer för anmält organ / จานวนขององค์กรทีไ่ ด้รบ Place Issued Im Hackacker 15, 8902 Urdorf, Switzerland 25.02.2016 Head of Process Analytics Division Head of Quality Management Waldemar Rauch Head of Process Analytics Division 30328910_DoC GPro 500.doc Figure 72 EC Declaration of conformity (page 2/2) 108 Peter Rowing Head of Quality Management Doc 30328910, Rev A, 02,2016                                                          λ  λ   λ  λ                                        Figure 73 SIL Declaration of conformity 109 Laser Spectrometer GPro 500 of Conformity INTERNATIONAL ELECTROTECHNICAL COMMISSION Certification Scheme for Explosive Atmospheres for mies and detaiis of the Certificate No.: Status: Scheme visit issue No.:1 issue No. 1 Current Date of 2016-02-08 Applicant: Mettler-Toledo GmbH Im 15 8902 Urdorf Switzerland Electrical Apparatus: Page 1 of 4 Tunable Diode Laser (refere to Annexe for exact type Optional accessory: Type of Protection: II Flameproof enclosure "d"; Optical radiation "op"; Protection by enclosure "t" Ex db [op is Ga] HC T6 Ob Ex tb [op is Da] T80 Db Marking: Approved for issue on Certification Body: Position: iECEx Martin iVlanager Signatare: ification Version) Date: This certificate and schedule may be reproduced in 2. This certificate is not transferable and remains the property of the issuing body. 3. The Status and authenticity of this certificate may be verified by visiting the Official IECEx Website. issued by: Eiectrosuisse div. Testing and Certification Luppmenstrasse 1 CH-8320 FEHRALTORF Switzerland Figure 74 IECEx Cerfificate (page 1/4) 110 electro IECEx Certificate of Conformity Certificate No.: 2016-02-08 Date of Issue: Issue No.: 1 Page 2 of 4 Mettler-Toledo GmbH Im Hackacker 8902 Urdorf Switzerland Manufacturer: Additional (s): location certificate is issued as verification a sample(s), representative of production, was assessed and tested and found to comply with the Standard list below and that the manufacturer's quality System, relating to the Ex products covered by this certificate, was assessed and found to comply with the IECEx Quality System requirements. This certificate is granted subject to the conditions as set out in IECEx Scheme Rules, IECEx 02 and Operational Documents as amended. STANDARDS: The electrical apparatus and any acceptable variations to it specified in the schedule of t h i | certificate documents, was found to comply with the following Standards: 60079-0 : 2011 Edition: 6.0 60079-1 : 2014-06 Edition: 7.0 60079-28 : Edition: 2 60079-31 : Edition: 2 This Certificate TEST & Explosive atmospheres - Part 0: General requirements ff the identified Explosive atmospheres - Part 1: Equipment protection by flameproof enclosures "d" Explosive atmospheres - Part 28: Protection of equipment and transmission Systems using optical radiation Explosive atmospheres - Part Equipment dust ignition protection by enclosure "t" not indicate compliance with electrical safety and Performance requirements other than those expressly included in the Standards listed above. REPORTS: A sample(s) of the equipment listed has successfully met the examination and test requirements as recorded in Test Report: Qualitv Assessment Report: Figure 75 IECEx Cerfificate (page 2/4) 111 Laser Spectrometer GPro 500 IECEx Certificate of Conformity Certificate No.; IECEx SEV Issue No.: 1 Date of Issue: Page 3 of 4 Schedule EQUIPMENT: Equipment and Systems covered by this certificate are as follows: The Tunable Diode Laser Spectrometer GPro500 should be approved for measuring concentrations of the specified gases in gas mixtures. The sensor GPro500 consists of a flameproof enclosure and contains optical elements, optoelecronics (diode and Silicon detectors), analog and digital electronics for signal processing and I/O structure. The sensor is driven by the IV1400 transmitter and communicates over RS485. The Sensor is connected to the process Over a probe with process window and corner cube. Due to the process window the spectrometer has no direct contact to Zone 0 and can be disconnected during the running process. Ratings: Supply Circuit max. 24 V max. 5 W Optical Radiation: Radiant power: max. mW Irradiance: max: CONDITIONS OF CERTIFICATION: Y E S as shown below: Repairs of the flameproof joints must be made in compliance with the constructive specifications provided by the manufacturer. Repairs must not be made on the basis of values specified in tables 1 and 2 of In the normal configuration, the temperature at the Interface between the sensor head and the probe should not exceed +55 The temperature at the Interface to the sensor head is more than +55 °C, the temperature T6 (85 is exceeded. the temperature exceeds +55 °C at the Interface, a thermal barrier to be used in addition. the temperature to The metal body of the TDL Spectrometer must be conductively connected with the Installation. Figure 76 IECEx Cerfificate (page 3/4) 112 than +55 has to bonding System of the IECEx Certificate of Conformity Certificate No.: IECEx Date of Issue: 2016-02-08 issue No.: 1 Page 4 of 4 DETAILS OF CERTIFICATE CHANGES (for issues 1 and above): Change of the manufacturers address Figure 77 IECEx Cerfificate (page 4/4) Annex: IECEx SEV Annexe Issue 113 Laser Spectrometer GPro 500 8.2 FM Approval (US Version) Oxygen Measurement 114 Ex classification: Cl I, Div 1, Grp A, B, C, D, T6 Cl II, III, Div 1, Grp E, F, G, T6 – Designation and number of the declaration: Original project ID 3044884                       Figure 78 Label for US version. 1 2 3 4 5 6 7 8 9 10 11 12  Gas to be measured: Oxygen (O2), Carbon monoxide (CO) or Water vapour (H2O) Manufacturer Country of origin Product name Product key Part no. Serial no. Ambient temperature limits FM markings Power rating Enclosure ratings SIL Mark Figure 79 Note label. M6x12 M4x6 Figure 80 Grounding labels. For further guidelines for FM compliance please also consult the following chapters of these operating instructions: –– see chapter 3 (Installation and Start-up) on page no 34 –– see chapter 5 (Electrical Connections) on page no 67 –– see chapter 7 (Operation, Maintenance and Calibration) on page no 94 115 Laser Spectrometer GPro 500 CERTIFICATE OF CONFORMITY 1. HAZARDOUS (CLASSIFIED) LOCATION ELECTRICAL EQUIPMENT PER US REQUIREMENTS 2. Certificate No: FM16US0256 3. Equipment: (Type Reference and Name) GPRo 500 Gas Sensor 4. Name of Listing Company: Mettler-Toledo GmbH 5. Address of Listing Company: 6. Im Hackacker 15 (Industrie Nord) CH-8902 Urdorf The examination and test results are recorded in confidential report number: 3044884 dated 9th January 2013 7. FM Approvals LLC, certifies that the equipment described has been found to comply with the following Approval standards and other documents: FM Class 3600:2011, FM Class 3615:2006, FM Class 3810:2005, ANSI/NEMA 250:1991, ANSI/IEC 60529:2004 8. If the sign ‘X’ is placed after the certificate number, it indicates that the equipment is subject to specific conditions of use specified in the schedule to this certificate. 9. This certificate relates to the design, examination and testing of the products specified herein. The FM Approvals surveillance audit program has further determined that the manufacturing processes and quality control procedures in place are satisfactory to manufacture the product as examined, tested and Approved. 10. Equipment Ratings: Explosionproof for Class I, Division 1, Groups A, B, C and D; Dust-ignitionproof for Class II, Division 1, Groups E, F and G; Class III, Division 1 hazardous (classified) locations, indoors and outdoors (Type 4X, IP65) with an ambient temperature rating of -20°C to +55°C. Certificate issued by: 19 August 2016 J. E. Marquedant Manager, Electrical Systems Date To verify the availability of the Approved product, please refer to www.approvalguide.com THIS CERTIFICATE MAY ONLY BE REPRODUCED IN ITS ENTIRETY AND WITHOUT CHANGE FM Approvals LLC. 1151 Boston-Providence Turnpike, Norwood, MA 02062 USA T: +1 (1) 781 762 4300 F: +1 (1) 781 762 9375 E-mail: information@fmapprovals.com www.fmapprovals.com F 347 (Mar 16) Figure 81 FM-Certificate. FM Approvals (page 1/3). 116 Page 1 of 3 SCHEDULE US Certificate Of Conformity No: FM16US0256 11. The marking of the equipment shall include: Class I Division 1, Groups A, B, C, D; T6 Ta = -20°C to +55°C; Type 4X, IP65 Class II, Division 1, Groups E, F, G, Class III, Division 1; T6 Ta = -20°C to +55°C; Type 4X, IP65 12. Description of Equipment: General - The GPro 500 Gas Sensor is an optical instrument designed for continuous in-situ gas monitoring in stack, pipes, and similar applications. The sensor is based on tunable diode laser absorption spectroscopy (TDLAS) technology. The GPro 500 Gas Sensor utilizes a single side installation without the need for alignment to measure the average gas concentration along the line of sight path in the probe. The measuring principle used is infrared single line absorption spectroscopy, which is based on the fact that each gas has distinct absorption lines at specific wavelengths. The GPro 500 consists of 3 separate units, the TDL head (which is explosionproof rated and the subject of this certificate), and the insertion probe which has no electrical connections, a junction box and the user interface M400 (which are not explosionproof rated). The flange mounted insertion probes are available in 3 lengths. Construction - The GPro 500 housing is a coated aluminum enclosure with a bolt on cover and is available with (1) ½ inch NPT conduit opening. Ratings - The GPro 500 TDL head contains the laser module with a temperature stabilized diode laser, collimating optics, the main electronics and data storage. The unit is rated for a maximum of 24 VDC, 5 Watts. The laser source has a maximum radiation strength of 0.24mW/mm². GPro 500-USabcdefghij_/_k. Gas Sensor. a = Gases: A0, A1, C0, H0, H1, C2, C1, CC, S0, S1, L0, L1, M0, M1, N0, or N1 b = Process Interface: P, F, B, H, W, S, E, A, C, or K c = Process Optics: B, C, Q, R, S, or T d = Process Sealing: K, G, E, V, S, I, F, or M e = Wetted Materials: S0, S1, C0, B0, T0, T1, C2, C4, A5, P0, P1, P2, S2, Z0, A0, S3, or S4 f = Optical path probes and extractive cell: 20, 40, 80, 01, 02, 03, 04, 05, 06, 10, or XX g = Process Connection: PD, PA, LD, LA, GD, GA, MD, MA, ND, NA, W1, W2, W3, W4, W5, W6, S1, S2, S3, S4, S5, S6, J1, J2, J3, J4, J5, J6, J7, J8, J9, EM, or EI h = Wall Thickness: 1, 2, 3, 4, 5, 6, or X i = Filter: A, B, C, D, E, F, or X j = Thermal Barrier: S or H k = Communication Interface: X or A 13. Specific Conditions of Use: None 14. Test and Assessment Procedure and Conditions: This Certificate has been issued in accordance with FM Approvals US Certification Requirements. THIS CERTIFICATE MAY ONLY BE REPRODUCED IN ITS ENTIRETY AND WITHOUT CHANGE FM Approvals LLC. 1151 Boston-Providence Turnpike, Norwood, MA 02062 USA T: +1 (1) 781 762 4300 F: +1 (1) 781 762 9375 E-mail: information@fmapprovals.com www.fmapprovals.com F 347 (Mar 16) Page 2 of 3 Figure 82 FM-Certificate. FM Approvals (page 2/3). 117 Laser Spectrometer GPro 500 SCHEDULE US Certificate Of Conformity No: FM16US0256 15. Schedule Drawings A copy of the technical documentation has been kept by FM Approvals. 16. Certificate History Details of the supplements to this certificate are described below: Date Description 9th Original Issue. January 2013 19th August 2016 Supplement 4: Report Reference: RR206189, dated 19th August 2016 Description of the Change: revised model code, label drawing and manual. THIS CERTIFICATE MAY ONLY BE REPRODUCED IN ITS ENTIRETY AND WITHOUT CHANGE FM Approvals LLC. 1151 Boston-Providence Turnpike, Norwood, MA 02062 USA T: +1 (1) 781 762 4300 F: +1 (1) 781 762 9375 E-mail: information@fmapprovals.com www.fmapprovals.com F 347 (Mar 16) Figure 83 FM-Certificate. FM Approvals (page 3/3). 118 Page 3 of 3 9 Troubleshooting 9.1 Error messages in the control unit During operation essential status information about the instrument is displayed on M400. The instrument messages and their possible explanations and actions to be taken are given in the table below. Table 11 Error messages Fault message Explanations and actions Action Signal Process Failed Error during the fitting procedure Laser Source Error Laser line not stable Bad Signal Quality Transmission absent or too low; Signal too noisy FAULT FAULT FAULT Flashcard Error Database error Simulation Mode Active O2 value manually set, not measured FAULT FAULT MAINTENANCE REQUIRED MAINTENANCE REQUIRED MAINTENANCE REQUIRED MAINTENANCE REQUIRED MAINTENANCE REQUIRED FAULT Pressure Input Error 4–20 mA signal out of range Pressure Input Invalid Pressure out of range T Input Error 4–20 mA signal out of range T Input invalid Pressure out of range Diskspace Low Diskspace on flashcard low Laser Control Error Failure or malfunction of laser temperature controller Internal T Exceeded System board temperature exceeds range MAINTENANCE REQUIRED Configuration Mode Ethernet connection active Hardware Error Software-hardware inconsistent; on-board voltage out of range MAINTENANCE REQUIRED FAULT Laser Source Error Laser current zero or out of range FAULT 119 120 Fitting of the line profiles failed. The laser wavelength has shifted. Readjustment of the laser temperature necessary Transmission lower than 5% threshold Signal Processing Failed Laser Source Error Source TDL Maintenance request Maintenance request TDL Maintenance request Fault Fault Fault Fault Fault Relay State TDL Clean corner cube and process window. TDL Check the gasket between TDL and probe. Rotate TDL on the probe to maximize Transmission. Reduce the dustload in the process. Perform a calibration with the calibration tube. TDL If still not successful, send unit back to METTLER TOLEDO for Flashcard exchange. Check external pressure sensor and mapping TDL Send unit back to METTLER TOLEDO M400 – This is the initial message after Power on. – Wait for the GPro™ 500 to fully boot. – Check if the GPro™ 500 is powered and wait until the system is fully started. – Check the RS485 wiring of the GPro™ 500 to the M400 – Check with the MT-TDL software and the Ethernet port if the system is running correctly. – If timeout still occurs after 60 s, send unit back to METTLER TOLEDO. Send unit back to METTLER TOLEDO TDL Action Pressure reading out of extended range: 0.6 bara < P < 8 bara 4 – 20 mA input error: 4 mA > P > 20 mA Temperature Input Error Pressure reading out of extended range: Check external temperature sensor and mapping –20°C P > 20 mA Configuration Mode Ethernet port in use: diagnostic or configurati- Disconnect Ethernet cable on in progress The GPro™ 500 error messages can be found in the M400 under the following path: Menu ➝ Service ➝ Diagnostics ➝ TDL ➝ Messages Pressure Input Error Flashcard Error Missing or bad calibration and / or database data The M400 is unable to detect any of the ISM sensor(s) it can identify. If no sensor is found it will disply the message NO SENSOR DETECTED No sensor on channel 3 Bad Signal Quality Comment Messages Software error System error System error Software error System error System error Software error B disconnected Mapping Laser Spectrometer GPro 500 10 Decommissioning, Storage and Disposal Please refer to chapter 1.1 (Safety information) on page no 11. Decommissioning may only be carried out by persons with appropriate training or by skilled technicians. 10.1 Decommissioning Proceed as described in chapter 7.3.2 (Remove the probe or wafer cell from the process) on page no 97. 10.2 Storage Store the GPro 500 in a dry place. 10.3 Disposal It is recommended that the operator disposes of the device in accordance with local regulations. The operator must deliver the device either to a licensed private or public disposal company, or dispose of it himself in accordance with prevailing regulations. Waste is to be recycled or disposed of without causing any risk to human health, and without using procedures or methods that might harm the environment. EC guidelines 75/442/EEC 91/156/EEC Sorting Sorting into waste groups takes place when dismantling the device. The groups are listed in the current European Waste Catalogue. This catalog is valid for all wastes, whether intended for disposal or for recycling. The packaging is made up of the following materials: –– Cardboard –– Foam plastic The housing is made of the following materials: –– Steel –– Polypropylene –– Medium wetted polymers as given in the specifications 121 Appendix 1 Compliance and Standards Information Laser Spectrometer GPro 500 –– The GPro 500 TDL complies with the European Community “Electromagnetic Compatibility Directive” and “Low Voltage Directive”. 122 –– The TDL is rated in accordance to Over voltage Category II, Pollution Degree. –– The TDL complies with the Class B digital apparatus requirements of ICES-003 of Canada through the application of EN 55011:2007. –– L’analyseur est conforme aux Conditions B numériques d’appareillage de classe de NMB-003 du Canada par l’application du EN 55011:2007. –– This TDL complies with Part 15 of the US FCC Rules for Class B equipment. It is suitable for operation when connected to a public utility power supply that also supplies residential environments. –– The TDL has been assessed to IEC 61010-1:2001 +Corr 1: 2002 + Corr 2:2003 for electrical safety including any additional requirements for US and Canadian national differences. –– Mettler Toledo Ltd is a BS EN ISO 9001 and BS EN ISO 14001 certified organization. Appendix 2 Spare Parts and Accessories 2.1 Configuration Options The complete ordering information of the GPro 500 can be depicted from the table below. An example order number might be GPro 500-ATBGR4404390_D12HT-AX which would be a unit with ATEX Ex d approval, standard window, standard O-ring, steel of quality 316L, a probe length of 390 mm, a process flange with the dimension DN50/PN25 and a thermal barrier. 123 Laser Spectrometer GPro 500 Table 12 GPro 500 Product key Gas Analyzer GPro™ 5 0 0 A T A 0 P B K S 0 2 0 P D 1 X S _ _ / _ X 30 027 126 GPro™ 5 0 0 Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y / Y Y * Other configurations upon request Hazardous area approvals ATEX/IECEx Ex d FM Class 1 Div 1 Gases Oxygen Oxygen and Temperature A A CO C H2O H CO2% C CO% C CO% + CO2% C H2S S HCl ppm L Process interface Standard Probe purged (SP) Non-purged Filter Probe (NP) Non-purged Filter Probe with Blow-back (BP) Wafer (W) Extractive Cell (E) Cross-pipe folded path (C) Process optics* Borosilicate | | | | | | | | | | | | | | | | | | | | | | | | | 0 | 1 | 0 | 0 | 2 | 1 | C | 1 | 0 | | P | F | B | W | E | C | | B Quartz Q Sapphire S Dual Window Borosilicate C Dual Window Quartz R Dual Window Sapphire T Process sealing* | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Kalrez 6375 K Graphite G Kalrez (FDA grade) 6230 F Wetted materials* | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | 1.4404 (equivalent to 316L) S 0 1.4571 S 1 Hastelloy C22 C 0 Optical path probes and extractive cell* 124 ||| ||| A T | U S | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | 200 mm 2 0 400 mm 4 0 800 mm 8 0 1m 0 1 2m 0 2 | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Gas Analyzer GPro™ 5 0 0 A T A 0 P B K S 0 2 0 P D 1 X S _ _ / _ X 30 027 126 GPro™ 5 0 0 Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y / Y Y * Other configurations upon request 3m 4m 5m 6m 10 m None Process connection* DN 50/PN 25 ANSI 2"/300 lbs |||||||||||| 0 3 | 0 4 | 0 5 | 0 6 | 1 0 | X X | | | | | | | | | | P D P A DN 50/PN 16 L D ANSI 2"/150 lbs L A DIN 80/PN 16 G D ANSI 3"/150 lbs G A DIN100/PN25 N D ANSI 4"/300 lbs N A DN 50/PN 16 W 1 DN 80/PN 16 W 2 DN 100/PN 16 W 3 ANSI 2"/150 lbs W 4 ANSI 3"/150 lbs W 5 ANSI 4"/150 lbs W 6 Swagelok 6 mm E M Swagelok ¼" E I Wall thickness* | | | | | | | | | | | | | | | | | | | | | | | | | 100 mm 1 200 mm 2 300 mm 3 None X Filter* | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Filter A – 40 µm A Filter B – 100 µm B Filter C – 200 µm C Filter D – 3 µm D Filter PTFE Membrane E No Filter X Thermal barrier* | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | No thermal barrier (up to 250 °C) S _ _ / _ With thermal barrier (up to 600 °C) H _ _ / _ Communication interface | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | RS 485 (for M400) X RS 485 and direct Analog (SIL) A 125 2.2 Spare parts Laser Spectrometer GPro 500 Table 13 Spare parts Spare parts Order number O2 Corner Cube Module A0 B B0 on request O2 Corner Cube Module A0 Q S0 on request O2 Corner Cube Module B 4404 30 038 091 O2 Corner Cube Module Q 4404 30 038 092 Corner Cube Module C0 F Q S0 30 111 366 Corner Cube Module H0 F B S0 30 111 367 Corner Cube Module H0 F Q S0 30 111 368 Kit Flat gasket ST 30 080 914 Kit Flat gasket HT (Graphite) 30 080 915 Filter S0 20 1 (40 µm) 30 111 369 Filter S0 20 2 (100 µm) 30 111 370 Filter S0 20 3 (200 µm) 30 111 371 Filter S0 40 1 (40 µm) 30 111 372 Filter S0 40 2 (100 µm) 30 111 373 Filter S0 40 3 (200 µm) 30 111 374 Filter S0 80 1 (40 µm) 30 111 375 Filter S0 80 2 (100 µm) 30 111 376 Filter S0 80 3 (200 µm) 30 111 390 2.3 Accessories Table 14 Accessories 126 Accessories Order number Thermal barrier 30 034 138 Junction box 30 034 149 Junction box with 24 VDC power supply 30 260 135 Purging box for M400 Ex d 30 034 148 Calibration kit 30 034 139 Gasket for process flange (82.14 x 3.53 mm) To be provided by the user Check valve To be provided by the user Cable GPro 500 ATEX, FM 5 m 30 077 735 Cable GPro 500 ATEX, FM 15 m 30 077 736 Cable GPro 500 ATEX, FM 25 m 30 077 737 M400, Type 3 52 121 350 M400 Pipe mount kit 52 500 212 M400 Panel mount kit 52 500 213 M400 Protective hood 52 500 214 GPro Pin Spanner 30 129 726 Appendix 3 Disposal in Accordance with the Waste Electrical and Electronic Equipment (WEEE) Directive The GPro 500S TDL is not considered to be within the scope of the Waste Electrical and Electronic Equipment (WEEE) Directive. The TDL is not intended for disposal in a municipal waste stream, but shall be submitted for material recovery and recycling in accordance with any appropriate local regulations. For additional information and advice on the disposal of the TDL, contact Mettler Toledo: Mettler-Toledo GmbH Im Hackacker 15 CH-8902 Urdorf Switzerland Tel: +41 44 729 61 45 Fax: +41 44 729 62 20 Global e-mail: info@mt.com If you send the TDL to Mettler Toledo or your local Mettler Toledo agent (see Sales and Service on page no 130) for disposal, it must be accompanied by a correctly completed decontamination certificate. 127 Laser Spectrometer GPro 500 Appendix 4 Equipment Protection 128 4.1 Traditional Relationship of Equipment Protection Levels (EPLs) to Zones Equipment Protection Level Zone (EPL) Ga Gb Gc Da Db Dc Zone 0 1 2 20 21 22 When these are used in the installation, no further risk assessment is required. Where a risk assessment has been used, this relationship can be broken so as to use a higher or lower level of protection. For more information on Equipment Protection Levels (EPLs) refer to Annex D of IEC 600790:2007 or EN 60079-0:2009 Ga 0 Gb 1 Gc 2 Da 20 Db 21 Dc 22 4.2 Relationship of Equipment Protection Levels to ATEX Categories Equipment Protection Level Zone (EPL) Ga Gb Gc Da Db Dc ATEX Category 1G 2G 3G 1D 2D 3D Appendix 5 ESD Guidelines ESD (ElectroStatic Discharge) ESD is the rapid, spontaneous transfer of electrostatic charge induced by a high electrostatic field. Electrostatic damage to electronic devices can occur at any point from manufacture to field service. Damage results from handling the devices in uncontrolled surroundings or when poor ESD control practices are used. Generally damage is classified as either a catastrophic failure or a latent defect. A catastrophic failure means that exposure to an ESD event has caused an electronic device to stop functioning. Such failures can usually be detected when the device is tested before shipment. A latent defect, on the other hand, is more difficult to identify. It means that the device has only been partially degraded from exposure to an ESD event. Latent defects are extremely difficult to prove or detect using current technology, especially after the device is assembled into a finished product. Usually, the charge flows through a spark between two objects at different electrostatic potentials as they approach one another. It is of utmost importance that ESD protective procedures are used during service in the field. The components used in GPro 500 have all been protected from ESD through the whole production chain. Ground Everything Effective ESD grounds are of critical importance in any operation, and ESD grounding should be clearly defined and regularly evaluated. According to the ESD Association Standard ANSI EOS/ESD all conductors in the environment, including personnel, must be bonded or electrically connected and attached to a known ground, bringing all ESD protective materials and personnel to the same electrical potential. This potential can be above a „zero“ voltage ground reference as long as all items in the system are at the same potential. It is important to note that non-conductors in an Electrostatic Protected Area (EPA) cannot lose their electrostatic charge by attachment to ground. ESD guidelines In many facilities, people are one of the prime generators of static electricity. Therefore, wrist straps must be used while carrying out maintenance and service on the GPro 500, to keep the person wearing it connected to ground potential. A wrist strap consists of the cuff that goes around the person‘s wrist and the ground cord that connects the cuff to the common point ground. Work Surface An ESD protective work surface is defined as the work area of a single individual, constructed and equipped to limit damage to ESD sensitive items. The work surface helps to define a specific work area in which ESD sensitive devices may be safely handled. The work surface is connected to the common point ground by a resistance to ground of 106 Ohms to 109 Ohms. This is done by using a soft bench mat, which is connected to ground, on the work surface. All equipment must be connected to grounded outlets and all personnel must wear wrist straps connected to the bench mat using a cord. 129 METTLER TOLEDO Market Organizations Sales and Service Sales and Service: Australia Mettler-Toledo Limited 220 Turner Street Port Melbourne, VIC 3207 Australia Phone +61 1300 659 761 e-mail info.mtaus@mt.com France Mettler-Toledo Analyse Industrielle S.A.S. 30, Boulevard de Douaumont FR - 75017 Paris Phone +33 1 47 37 06 00 e-mail mtpro-f@mt.com Austria Mettler-Toledo Ges.m.b.H. Laxenburger Str. 252/2 AT -1230 Wien Phone +43 1 607 4356 e-mail prozess@mt.com Germany Mettler-Toledo GmbH Prozeßanalytik Ockerweg 3 DE - 35396 Gießen Phone +49 641 507 444 e-mail prozess@mt.com Brazil Mettler-Toledo Ind. e Com. Ltda. Avenida Tamboré, 418 Tamboré BR - 06460-000 Barueri / SP Phone +55 11 4166 7400 e-mail mtbr@mt.com Great Britain Mettler-Toledo LTD 64 Boston Road, Beaumont Leys GB - Leicester LE4 1AW Phone +44 116 235 7070 e-mail enquire.mtuk@mt.com Canada Mettler-Toledo Inc. 2915 Argentia Rd #6 CA -ON L5N 8G6 Mississauga Phone +1 800 638 8537 e-mail ProInsideSalesCA@mt.com Hungary Mettler-Toledo Kereskedelmi KFT Teve u. 41 HU -1139 Budapest Phone +36 1 288 40 40 e-mail mthu@axelero.hu China Mettler-Toledo International Trading (Shanghai) Co. Ltd. 589 Gui Ping Road Cao He Jing CN - 200233 Shanghai Phone +86 21 64 85 04 35 e-mail ad@mt.com India Mettler-Toledo India Private Limited Amar Hill, Saki Vihar Road Powai IN - 400 072 Mumbai Phone +91 22 2857 0808 e-mail sales.mtin@mt.com Croatia Mettler-Toledo d.o.o. Mandlova 3 HR -10000 Zagreb Phone +385 1 292 06 33 e-mail mt.zagreb@mt.com Czech Republic Mettler-Toledo s.r.o. Trebohosticka 2283 / 2 CZ -100 00 Praha 10 Phone +420 2 72 123 150 e-mail sales.mtcz@mt.com Denmark Mettler-Toledo A /S Naverland 8 DK - 2600 Glostrup Phone +45 43 27 08 00 e-mail info.mtdk@mt.com ISO 9001 certified Indonesia PT. Mettler-Toledo Indonesia GRHA PERSADA 3rd Floor Jl. KH. Noer Ali No.3A, Kayuringin Jaya Kalimalang, Bekasi 17144, ID Phone +62 21 294 53919 e-mail mt-id.customersupport@mt.com Italy Mettler-Toledo S.p.A. Via Vialba 42 IT - 20026 Novate Milanese Phone +39 02 333 321 e-mail customercare.italia@mt.com Japan Mettler-Toledo K.K. Process Division 6F Ikenohata Nisshoku Bldg. 2-9-7, Ikenohata Taito-ku JP -110-0008 Tokyo Phone +81 3 5815 5606 e-mail helpdesk.ing.jp@mt.com Malaysia Mettler-Toledo (M) Sdn Bhd Bangunan Electroscon Holding, U 1-01 Lot 8 Jalan Astaka U8 / 84 Seksyen U8, Bukit Jelutong MY - 40150 Shah Alam Selangor Phone +60 3 78 44 58 88 e-mail MT-MY.CustomerSupport@mt.com Mexico Mettler-Toledo S.A. de C.V. Ejército Nacional #340 Polanco V Sección C.P. 11560 MX - México D.F. Phone +52 55 1946 0900 e-mail mt.mexico@mt.com Norway Mettler-Toledo AS Ulvenveien 92B NO - 0581 Oslo Norway Phone +47 22 30 44 90 e-mail info.mtn@mt.com Poland Mettler-Toledo (Poland) Sp.z.o.o. ul. Poleczki 21 PL - 02-822 Warszawa Phone +48 22 545 06 80 e-mail polska@mt.com Russia Mettler-Toledo Vostok ZAO Sretenskij Bulvar 6/1 Office 6 RU -101000 Moscow Phone +7 495 621 56 66 e-mail inforus@mt.com Singapore Mettler-Toledo (S) Pte. Ltd. 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XX/ 2015. © Mettler-Toledo GmbH Printed in Switzerland. 52 XXX XXX Mettler-Toledo GmbH, Process Analytics Im Hackacker 15, CH - 8902 Urdorf, Switzerland Phone + 41 44 729 62 11, Fax +41 44 729 66 36 www.mt.com/pro Competence Center The Latest News on Applications and Products Visit us online to discover white papers, application notes, how-to videos and our list of upcoming webinars. c www.mt.com/gas www.mt.com For more information Mettler-Toledo GmbH Process Analytics Im Hackacker 15 CH-8902 Urdorf Switzerland Phone +41 729 62 11 Fax +41 729 66 36 Subject to technical changes © 08/2016 Mettler-Toledo GmbH Printed in Switzerland. 30 029 557 Management System certified according to ISO 9001 / ISO 14001 Competence Center The Latest News on Applications and Products Visit us online to discover white papers, application notes, how-to videos and our list of upcoming webinars. c www.mt.com/o2-gas www.mt.com For more information Mettler-Toledo GmbH Process Analytics Im Hackacker 15 CH-8902 Urdorf Switzerland Phone +41 729 62 11 Fax +41 729 66 36 Subject to technical changes © 08/2016 Mettler-Toledo GmbH Printed in Switzerland. 30 029 557 Management System certified according to ISO 9001 / ISO 14001